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Transducer transfer stack

A technology of stacking bodies and transducers, which is applied in the direction of instruments, sensors, scientific instruments, etc., and can solve problems such as aggravation

Active Publication Date: 2018-03-09
KONINKLJIJKE PHILIPS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This need may be exacerbated by the need to transfer a substantially flat device to a curved surface such as the shaft of a catheter or needle

Method used

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  • Transducer transfer stack
  • Transducer transfer stack
  • Transducer transfer stack

Examples

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Embodiment Construction

[0022] As mentioned above, the invention provides a transfer stack TS for transferring a portion of a foil within a perimeter P including a transducer T to an object A. The invention also discloses an object comprising the portion, a method for forming the transfer stack and a method of attaching the portion of the foil F within the perimeter P to the object.

[0023] Transfer stacks and related methods are particularly useful in the medical field where it is desired to be able to attach transducers, ie sensors or actuators, to medical devices. Although the transfer stack is suitable for use in the medical field, it also has wide application in the field of transducers in general.

[0024] Figure 1 shows three exemplary layer structures (A, B, C) which illustrate some of the principles utilized in the present invention. exist Figure 1A , the layer L1 is attached to the substrate S, for example by van der Waals forces or an adhesive layer. The substrate S and the layer L1 a...

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Abstract

The invention relates to a transfer stack (TS) for transferring a portion of a foil within a perimeter (P) that includes a transducer (T) to an article (A) such as a medical device or a medical needle. The transfer stack includes a carrier substrate (CS), a foil (F) having a transducer (T) incorporated therein, and the transducer is laterally surrounded by a perimeter (P). The foil (F) is separable from the carrier substrate (CS) by overcoming a first peel retaining force (PRF1). An adhesive layer (AL) is also attached to the foil. The adhesive layer (AL) is configured to provide adhesion between the foil (F) and an article (A) such that when the article (A) is attached to the foil via the adhesive layer (AL) the foil (F) is separable from the surface of the article (A) by overcoming a second peel retaining force (PRF2). The second peel retaining force (PRF2) is greater than the first peel retaining force (PRF1).

Description

technical field [0001] The present invention relates generally to the field of transducer assemblies and may be used to attach transducers to objects. More particularly, the present invention relates to the attachment of piezoelectric transducers to medical devices, and may be used, for example, to attach piezoelectric ultrasound transducers to medical needles. Background technique [0002] Technological advances such as micromachining and planar processing have enabled the fabrication of a wide variety of transducers that can be used in all industrial fields from electronics, optics, biotechnology, solar to medical device fields. These transducers, including ultrasonic, thermal, optical and mechanical devices, have enabled many sensing and energy conversion applications. Conventionally, transducers used in such applications are manufactured separately from the device for which they are ultimately used. Therefore, there is a need for a method of attaching a transducer to t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B06B1/00
CPCB06B1/00A61B2562/125B06B2201/76B31D1/028A61B17/3403A61B2017/00526A61B2017/3413B06B1/0688B06B2201/56G01N29/2437
Inventor W-J·A·德维吉斯J·W·威克普C·G·菲瑟
Owner KONINKLJIJKE PHILIPS NV
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