Cutting method of cutting ultrasonic auxiliary lines and apparatus thereof, and a method of producing wafers

Abstract

A sawing method of cutting ultrasonic auxiliary lines includes a preparation step and a cutting step. The preparation step includes: providing an ultrasonic auxiliary line cutting apparatus and a to-be-cut object, wherein the ultrasonic auxiliary line cutting apparatus includes a tank defining a receiving space having an opening, an ultrasonic vibrator disposed in the tank, a cutting liquid arranged in the receiving space, and multiple cutting lines located above the opening and spaced apart from the cutting liquid. The cutting step includes moving the to-be-cut object towards the direction ofthe cutting lines so that the to-be-cut object is cut by the cutting lines to form multiple cut grooves and is immerged into the cutting liquid, each of the cut grooves having a radial width generating capillary action and allowing the cutting liquid to enter the cut grooves by the capillary action. Therefore, ultrasonic energy can be simultaneously conducted to the to-be-cut object and the cutting lines to avoid line jumping or breaking of the cutting lines and reduce the energy loss. The invention also provides an ultrasonic auxiliary line cutting apparatus for executing the method and a method of producing wafers.

Description

technical field [0001] The invention relates to a cutting method and its device, in particular to an ultrasonic-assisted wire cutting method and its device, and a chip manufacturing method. Background technique [0002] China Patent Publication No. 103085179A (hereinafter referred to as the previous case) discloses an ultrasonic wire cutting method and special equipment. refer to figure 1 An ultrasonic wire cutting device 1 of the previous case includes a solution tank 12 that can accommodate cutting liquid (suspension mortar) 11, an ultrasonic vibrating plate 13 arranged in the solution tank 12, and two opposite sides of the solution tank 12. The guide wheel 14 on the side, and a plurality of cutting wire nets 15 surrounding the guide wheel 14 and having a cutting side 151 on the solution tank 12, a crystalline silicon ingot 100 to be cut is placed on the cutting side 151 . [0003] refer to figure 2 , make the cutting wire net 15 do reciprocating cutting motion, and m...

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Problems solved by technology

[0004] However, when the ultrasonic wire cutting device 1 of the previous proposal is combined with its ultrasonic wire cutting method for cutting, it is necessary to immerse the crystalline silicon ingot 100 to be cut and the cutting side 151 of the cutting wire mesh 15 into the cutting liquid (suspension Mortar) 11, and cutting in the cutting fluid (suspension mortar) 11, which will cause the loss of cutting energy of the cutting wire network 15, in addition, because the cutting process must have the crystalline silicon ingot 100 and the The cutting wire net 15 is immersed in the cutting fluid 11, which may easily cause jumping and disconnection of the cutting wire net 15.

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