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Sensor installation structure and financial device

A technology of installation structure and sensor, applied in the direction of instruments, coin-accepting devices, coin-free or similar appliances, etc., can solve problems such as difficult processing and fracture, and achieve reduced processing difficulty, long service life, and reduced maintenance costs. Effect

Pending Publication Date: 2018-03-23
SHENZHEN YIHUA COMP +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a sensor installation structure to solve the technical problems in the prior art that the traditional sensor clamping structure is easy to break during use and difficult to process

Method used

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  • Sensor installation structure and financial device
  • Sensor installation structure and financial device
  • Sensor installation structure and financial device

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Embodiment Construction

[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0031] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0032] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations...

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Abstract

The invention, which belongs to the field of financial equipment, provides a sensor installation structure and a financial device. The sensor installation structure comprises a sensor frame, a sensorsignal terminal arranged on the sensor frame, an elastic buckle arranged on the sensor frame, a terminal accommodation hole, and a buckle hole; and the terminal accommodation hole arranged on a functional module is used for accommodating the sensor terminal and the buckle hole arranged on the functional module is clamped with the elastic buckle. According to the sensor installation structure and the financial device, the processing difficulty of the elastic buckle is reduced and thus the dimension precision of processing of the elastic buckle is controlled easily; and the hole structure is processed on the functional module easily, so that the processing difficulty of the whole clamping structure is reduced. Meanwhile, because of the elastic buckle arranged at the sensor frame, the elasticbuckle is separated from the buckle hole conveniently during the dismounting process, so that the operation convenience is improved, the buckle breaking is avoided, and thus the service of the clamping structure is prolonged.

Description

technical field [0001] The invention belongs to the technical field of financial equipment, and more specifically relates to a sensor installation structure and financial equipment including the sensor installation structure. Background technique [0002] Financial equipment involves the processing of cash and bills. Generally, sensors are installed in each functional module to complete the sensing needs of banknotes or bills. The existing sensor installation structure generally adopts a card point on the side of the sensor, and a protruding buckle on the functional module, and the fixing is realized by connecting the card point and the buckle. During the disassembly process, the card is moved The operation of the buckle is difficult, and it is prone to the phenomenon that the buckle is hard stuck by the stuck point and the buckle is broken, and the broken buckle falls into the inside of the device, which also causes difficulties for subsequent processing; moreover, the prot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G07D11/00G07D7/00G07F19/00F16B21/06
CPCG07D7/00G07D11/10G07F19/201F16B21/06
Inventor 龙腾敏谭元锦
Owner SHENZHEN YIHUA COMP
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