A kind of flexible oled display device and sealing method

Abstract

The present invention provides a flexible OLED display device and a sealing method. The device includes: a flexible substrate substrate, the flexible substrate substrate includes a display area and a non-display area, and the non-display area includes a first connection area; a crystal film, corresponding to the first connection area, disposed on the edge of the flexible substrate; and a connection terminal, located between the flexible substrate and the chip-on-film, for electrically connecting the chip-on-film and the flexible base substrate; wherein, the COF covers at least a part of the non-display area of ​​the flexible base substrate, and the flexible base substrate is also provided with a first sealing area and a The recessed area, the first sealing area and the recessed area are sequentially arranged in parallel on a side of the first connection area away from the display area. In order to solve the problem that the glass cannot be peeled off normally and the connection is unstable due to glass residue.

Description

Technical field [0001] The invention relates to the field of display technology, in particular to a flexible OLED display device and a sealing method. Background technique [0002] AMOLED has the characteristics of high resolution, wide viewing angle, fast response, and self-luminous. In the flexible AMOLED bonding (bonding) process, in order to prevent the connection terminals from being corroded, an encapsulation process is often performed after the connection process to protect the connection terminal structure from corrosion while improving the stability of the connection. However, there is a risk of applying glue on the back of the chip on film (COF) connection, because the thickness of the sealant cannot be applied too thick, which will cause the sealant to contact the back glass, and will remain on the back glass after curing. When the backplane is peeled off by laser, the glass will not peel off normally and the product will be scrapped. [0003] In summary, the prior art...

AI Technical Summary

Problems solved by technology

However, there is a risk in applying glue on the back of the chip-on-film (COF) connection, because the thickness of the sealant cannot be applied very thickly, which will cause the sealant to contact the backplane glass, and it will remain on the backplane glass after curing. When laser peeling off the backplane, the glass will not be peeled off normally and the product will be scrapped

[0003] To sum up, in the prior art flexible OLED connection process and sealing process, there are problems that the glass cannot be normally laser peeled off due to glass residue, and the connection is unstable.

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