Reflow oven liner with a substrate and an adhesive layer, and a method for treating the surface of a reflow oven

A reflow oven, adhesive technology, applied in the field of reflow oven liner with substrate and adhesive layer and used to treat the surface of reflow oven, can solve uneven application, messy, difficult to apply, etc. question

Inactive Publication Date: 2018-03-27
ILLINOIS TOOL WORKS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Latex materials are applied with a brush or roller and as such can be messy or difficult to apply and can be applied unevenly on the furnace surface
In some cases, latex materials with a temperature limit of about 100°C may not be sufficiently high for reflow oven operation

Method used

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  • Reflow oven liner with a substrate and an adhesive layer, and a method for treating the surface of a reflow oven
  • Reflow oven liner with a substrate and an adhesive layer, and a method for treating the surface of a reflow oven
  • Reflow oven liner with a substrate and an adhesive layer, and a method for treating the surface of a reflow oven

Examples

Experimental program
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Embodiment Construction

[0031] While the device is amenable to embodiments in many forms, a presently preferred embodiment is shown in the drawings and will hereinafter be described, it being understood that the disclosure is considered an example of a device and is not intended to be limited to the particular ones shown. Example.

[0032] Solder paste is commonly used in the assembly of printed circuit boards, where the solder paste is used to bond electronic components to the circuit board. Solder paste includes solder for joint formation and flux for preparing metal surfaces for solder attachment. Solder paste may be deposited on metal surfaces (eg, electronic pads) provided on a circuit board using any number of application methods. The leads of the electronic components are aligned with and stamped into the solder deposited on the pads to form the assembly. During the solder reflow process, the solder is then heated to a temperature sufficient to melt the solder and cooled to permanently (elec...

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Abstract

A liner (92) for contamination control in a reflow oven, which reflow oven has surfaces, includes a substrate (94) having a length and a width defining an area. The substrate (94) has a thickness defined by first and second sides. An adhesive is positioned on the first side of the substrate (94). The substrate (94) is removably adhered to the surfaces of the reflow oven, and the liner (92) is configured to accumulate solder reflow contaminants thereon or to repel solder flux vapors and / or fumes, and is configured for removal from the surfaces with any accumulated contaminants. A method of treating the surfaces of a reflow oven is also disclosed.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit and priority of U.S. Provisional Patent Application Serial No. 62 / 164,855, filed May 21, 2015, the disclosure of which is incorporated herein in its entirety. Background technique [0003] Electronic components are typically surface mounted on printed circuit boards using a reflow soldering process. This process takes place in a reflow oven, which is designed to heat printed circuit boards during the reflow soldering process. [0004] In the manufacture of printed circuit boards, electronic components are usually surface mounted to bare boards by a process known as "soldering reflow". In the known reflow soldering process, a pattern of solder paste is deposited on a circuit board and the leads of one or more electronic components are inserted into the deposited solder paste. The circuit board is then passed through the furnace, where the solder paste is reflowed (i.e., heated to melt...

Claims

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Application Information

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IPC IPC(8): B23K1/008B23K3/04B23K3/08C09D133/00F27B9/30F27B9/34F27D1/10F27D1/16
CPCB23K1/008B23K3/04B23K3/08F27B9/3077F27B9/24F27D7/04F27D9/00F27D2009/0072H01L21/67109H01L21/67173H01L21/6776F27D1/0003F27D1/1684B08B7/0014B08B9/027
Inventor 保罗·M·布莱尔伊丽莎白·B·贝利
Owner ILLINOIS TOOL WORKS INC
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