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Pump system

A technology of pump system and vacuum pump, which is applied in the field of pump system, can solve the problems of partial cooling of process gas and undesired condensation, and achieve the effects of preventing damage, homogenizing heat distribution, and saving costs

Active Publication Date: 2018-03-27
レイボルドゲーエムベーハー
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Another problem with these processes is that the use of purge gas supplied to the vacuum pump can lead to localized cooling of the process gas at the supply location
This may cause undesired condensation and / or deposits

Method used

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Embodiment Construction

[0061] According to the invention, the pump system 10 includes at least one vacuum pump 12 having an inlet 14 and an outlet 16 . Another vacuum pump can be connected to the inlet 14 and / or the outlet 16 .

[0062] The vacuum pump 12 is connected to a cooling element 18 which is fluidly connected to a coolant supply line 20 and a coolant discharge line 22 . The coolant is supplied to the cooling element 18 via the coolant supply pipe 20 , absorbs heat generated by the vacuum pump 12 at the cooling element 18 , and is then discharged from the vacuum pump 12 via the coolant discharge pipe 22 .

[0063] The coolant supply pipe 20 and the coolant discharge pipe 22 are connected with a heat exchanger 24 . The coolant supply pipe 20 and the coolant discharge pipe 22 constitute a first coolant circuit 26 . A coolant inlet 28 and a coolant outlet 30 are connected to the heat exchanger 24 . The coolant inlet 28 and the coolant outlet 30 form a second cooling circuit 27 which is conne...

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PUM

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Abstract

The invention relates to a pump system comprising a vacuum pump (12) and a cooling element (18) connected to said vacuum pump (12). A coolant feed (20) and a coolant discharge (22) are connected to the cooling element (18) for the purpose of cooling said vacuum pump by virtue of receiving and discharging heat using a coolant. The coolant feed (20) and coolant discharge (22) are connected to a heatexchanger (24) such that heat is transferred from the coolant discharge (22) to said coolant feed (20).

Description

technical field [0001] The present invention relates to a pump system, in particular for pumping gas / vapor close to the point of condensation and / or close to the point of deposition. Background technique [0002] In some coating processes (such as in the semiconductor industry or in the manufacture of flat screens), it is necessary to deliver gas / vapor close to the point of condensation (transformation from gas to liquid) and / or close to the point of deposition (transformation into solid). In particular, the second case is critical for vacuum pumps, since the solids produced can accumulate in the vacuum pump in the form of dust or deposits and block the vacuum pump. This happens first on the discharge side of the vacuum pump, where higher pressure prevails and the vapor is closer to the condensation / deposition point. [0003] One way to avoid this problem is to dilute the steam with additional gases (eg gas ballast, purge gas) and keep their partial pressure sufficiently lo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F04B39/06F04C29/04F04D19/04F04D29/58F04C18/12F04C18/344F04C18/16
CPCF04B39/06F04C25/02F04C29/04F04C2220/12F04D19/04F04D29/584F04B37/14F04B53/08F04C2270/19F04D17/168F04D19/042
Inventor 托马斯·德赖费特罗兰·穆勒马克斯·佩利坎丹尼尔·施奈登巴赫克里斯蒂安·拜尔
Owner レイボルドゲーエムベーハー