Thermosetting resin composition, resin encapsulating substrate and electronic device
A resin composition and resin sealing technology, used in circuits, electrical components, electrical solid devices, etc., can solve problems such as poor assembly processes and achieve the effect of suppressing position deviation
Pending Publication Date: 2018-04-03
SUMITOMO BAKELITE CO LTD
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Problems solved by technology
However, in recent years, the technical level required for wiring boards has been higher and higher. According to the thermal history of the process of assembling a semiconductor package using a wiring board, the size of the board changes, thereby causing defects in the assembly process. become a technical subject
Method used
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[0027] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in all drawings, the same code|symbol is attached|subjected to the same component, and description is abbreviate|omitted suitably.
[0028] First, the components of the thermosetting resin composition of the present embodiment will be described.
[0029] (thermosetting resin)
[0030] The thermosetting resin composition of this embodiment may contain a thermosetting resin.
[0031] The above-mentioned thermosetting resin is not particularly limited, and may contain, for example, an epoxy resin.
[0032] It does not specifically limit as said epoxy resin, For example, all monomers, oligomers, and polymers which have 2 or more epoxy groups in 1 molecule can be used.
[0033] Specific examples of such epoxy resins include, for example: biphenyl type epoxy resin; bisphenol A type epoxy resin, bisphenol F type epoxy resin, tetramethylbisphenol F type epoxy resi...
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Abstract
A thermosetting resin composition is used for forming a resin sealing substrate, and the following conditions are met: 1, a cured product of the thermosetting resin composition is obtained through transfer molding (175 DEG C for 120 seconds); first heat treatment (175 DEG C for 4 hours) is then carried out on the cured product; the shrinkage rate of the cured product after the first heat treatmentrelative to 25 DEG C of the mold size is set to be s1; the solidification object is further subjected to second heat treatment (the time when the temperature reaches 190 DEG C is set to be t1, the time when the temperature increases to 233 + / -3 DEG C from the 190 DEG C then reduces to 190 DEG C is set to be t2, and the t2-t1 is 100 + / -50 seconds. ), a third heat treatment (125 DEG C for 2 hours),a fourth heat treatment (175 DEG C for 6 hours) sequentially, and the shrinkage rate of the processed cured product when compared with at 25 DEG C of the size of the mold to be S4, the following formula: 0.85*s1<= S4<=1.15*S1(1-1) is met.
Description
technical field [0001] The present invention relates to a thermosetting resin composition, a resin-sealed substrate, and an electronic device. Background technique [0002] In recent years, along with miniaturization and high performance of electronic equipment, high-density integration and high-density mounting of electronic components have gradually progressed. Accompanying this situation, the reduction in manufacturing cost is demanded in addition to the thinning, high-density wiring, and multi-terminal increase that are gradually increasing at present for the wiring board of the semiconductor package on which the above-mentioned electronic components are mounted. [0003] Conventionally, as a wiring board of the above-mentioned semiconductor package, a build-up board having a core layer can be mentioned. Furthermore, in a typical manufacturing process of the above-mentioned buildup substrate having a core layer, a process of forming multilayer wiring on both surfaces of...
Claims
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IPC IPC(8): C08L63/00C08K7/18C08G59/62H01L23/14H01L23/498
CPCH01L23/49894H01L23/145C08G59/621C08K7/18C08L63/00H01L2924/181H01L2224/16225H01L2224/48091H01L2224/73265H01L2924/00012H01L2924/00014C08J3/12C08J5/18C08K3/013H01L23/147
Inventor 篠崎裕树牧原康二
Owner SUMITOMO BAKELITE CO LTD