An electronic equipment manufacturing method and electronic equipment are provided in the present invention. The electronic equipment has a device main body and a casing. The device main body comprises a circuit substrate, a first frame and a second frame, the casing comprises a first casing and a second casing. The first frame has a first pin and a second pin, the second frame and the circuit substrate have porous parts for the first pin, the first casing has an embedded hole for the second pin. The manufacturing method for the electronic equipment has: the substrate positioning working procedure (S02), for positioning the circuit substrate on the first frame by inserting the first pin into the porous part; the second frame positioning working procedure (S03), for positioning the second frame on the first frame by inserting the first pin into the porous part; the first frame positioning working procedure (S05, S06), for positioning the first frame on the first casing by embedding the second pin into the embedded hole; the second casing mounting working procedure (S12), for mounting the second casing on the first casing.