Manufacturing method of thin-film module
A technology of thin film components and manufacturing methods, which is applied to the photolithographic process of patterned surfaces, originals for photomechanical processing, optics, etc., and can solve problems such as damage, cracking, and difficulty in cleaning the protective film
Active Publication Date: 2018-04-06
TAIWAN SEMICON MFG CO LTD
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Problems solved by technology
[0004] However, the protective film is usually a light-transmitting film, which may become distorted, cracked, or otherwise damaged according to certain traditional process steps, and the protective film is susceptible to contamination during certain process steps, while for The protective film is difficult to clean, so it is not possible to produce a good quality protective film
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[0028] The following disclosure provides many different embodiments or examples to implement different features of the disclosure. However, the following disclosures in this specification describe specific examples of each component and its arrangement in order to simplify the description of the invention. Of course, these specific examples are not intended to limit the present disclosure. For example, if the following disclosure in this specification describes that a first feature is formed on or above a second feature, it means that it includes the embodiment in which the above-mentioned first feature and the above-mentioned second feature are formed in direct contact , also includes an embodiment in which additional features may be formed between the above-mentioned first feature and the above-mentioned second feature, so that the above-mentioned first feature and the above-mentioned second feature may not be in direct contact. In addition, different examples in the descri...
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Abstract
The invention discloses a manufacturing method of a thin-film module. The manufacturing method of the thin-film module comprises the following steps: forming a first material layer on one wafer, wherein the first material layer is a light-transmitting thin film; forming a second material layer on the first material layer; forming one opening in the second material layer, wherein the opening exposes one central part of the first material layer; forming one groove in the second material layer, wherein the groove surrounds the opening; forming one protective layer on the second material layer, and enabling the opening to be filled with the protective layer, so as to cover the central part of the first material layer; carrying out one laser technology along the groove, and enabling the grooveto extend and pass through the second material layer and the first material layer, so as to remove the second material layer and the first material layer outside the groove; and after the laser technology is carried out, removing the protective layer and the wafer, so that the thin-film module is formed.
Description
technical field [0001] The present disclosure relates to a method of manufacturing a thin film module, in particular to a method of manufacturing a thin film module applicable to a pellicle membrane of a mask. Background technique [0002] The semiconductor integrated circuit industry has undergone rapid growth. Advances in integrated circuit materials and design techniques have produced several generations of integrated circuits. Each generation of integrated circuits has smaller and more complex circuits than the previous generation. During the development of integrated circuits, the density of functions (that is, the number of connected devices per chip area) usually increases, and the geometric size (that is, the smallest component or circuit that can be manufactured in the process ) shrinks. Dimension reduction processes generally offer the advantages of increased production efficiency and reduced costs. However, the reduction in size also increases the complexity of ...
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IPC IPC(8): G03F1/62
CPCG03F1/62
Inventor 陈炫辰王宣懿林云跃林志诚李信昌
Owner TAIWAN SEMICON MFG CO LTD