Pressure sensor chip and manufacturing method thereof

Abstract

The invention discloses a pressure sensor chip and a manufacturing method thereof. According to the technical scheme, designed is a new accommodation space formed by a first cavity, a second cavity and separation grooves, which are communicated mutually, and used for accommodating pressure sensitive components; and the outer walls of the accommodation space are provided with pressure leading holesto enable the accommodation space to be communicated with the external gas environment. The novel stress isolation structure can reduce the influence of environment stress on the performance of the pressure sensor chip, solves the lead wire protection problem, surface flexible glue coating problem and packaging stress and welding thermal stress problem of the pressure sensor chip in plastic package in the prior art, and can meet low-cost and high-efficiency all-mold plastic package requirements of a pressure sensor.

Description

technical field [0001] The invention relates to the field of sensor chip manufacturing, in particular to a pressure sensor chip and a manufacturing method thereof. Background technique [0002] MEMS pressure sensor refers to the pressure sensor made by micro-electro-mechanical system (MEMS, Micro-Electro-Mechanical System) principle and process. The pressure sensors of field effect tube type and surface acoustic wave sensing principle can all be mass-produced, miniaturized, integrated and intelligentized by applying MEMS technology. [0003] Various types of pressure sensors have different structures and principles, but they all have one thing in common, that is, the external pressure must be transmitted to the pressure-sensitive element. The media for transmitting external pressure are different and have different physical and chemical characteristics. Pressure sensors must also adapt to environmental requirements. , adopting different pressure transmission designs. For s...

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Problems solved by technology

[0009] The invention provides a pressure sensor chip and a manufacturing method thereof. By designing a new stress isolation structure for the pressure sensor chip, the influence of environmental stress on the performance of the pressure sensor is reduced, and the problems existing in the plastic packaging of the pressure sensor chip in the prior art are solved. Lead protection, surface coating soft glue, packaging stress and welding thermal stress, realize low-cost, high-efficiency full-mold plastic packaging of pressure sensors

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