Pressure sensor chip and manufacturing method thereof

A pressure sensor and pressure technology, which is applied in the direction of fluid pressure measurement by changing the ohmic resistance, can solve the problems of wire protection, surface coating with soft glue, etc., and achieve the effect of solving the problem of wire protection

Active Publication Date: 2018-04-10
安徽京芯传感科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] The invention provides a pressure sensor chip and a manufacturing method thereof. By designing a new stress isolation structure for the pressure sensor chip, the influence of environmental stress on the performance of the pressure sensor is reduced, and the problems existing in the plastic packaging of the pressure sensor chip in the prior art are solved. Lead protection, surface coating soft glue, packaging stress and welding thermal stress, realize low-cost, high-efficiency full-mold plastic packaging of pressure sensors

Method used

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  • Pressure sensor chip and manufacturing method thereof
  • Pressure sensor chip and manufacturing method thereof
  • Pressure sensor chip and manufacturing method thereof

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Embodiment Construction

[0051] In order to make the purpose, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings and examples.

[0052] Embodiments of the present invention include a pressure sensor chip suitable for plastic packaging and a manufacturing method thereof. The following description is provided to enable those skilled in the art to make and use the invention, and is provided in a context consistent with the specific procedures and requirements of the patent. Various modifications to the preferred embodiment will be readily apparent to those skilled in the art, and the basic principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the invention. Thus, the present invention is not limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features d...

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Abstract

The invention discloses a pressure sensor chip and a manufacturing method thereof. According to the technical scheme, designed is a new accommodation space formed by a first cavity, a second cavity and separation grooves, which are communicated mutually, and used for accommodating pressure sensitive components; and the outer walls of the accommodation space are provided with pressure leading holesto enable the accommodation space to be communicated with the external gas environment. The novel stress isolation structure can reduce the influence of environment stress on the performance of the pressure sensor chip, solves the lead wire protection problem, surface flexible glue coating problem and packaging stress and welding thermal stress problem of the pressure sensor chip in plastic package in the prior art, and can meet low-cost and high-efficiency all-mold plastic package requirements of a pressure sensor.

Description

technical field [0001] The invention relates to the field of sensor chip manufacturing, in particular to a pressure sensor chip and a manufacturing method thereof. Background technique [0002] MEMS pressure sensor refers to the pressure sensor made by micro-electro-mechanical system (MEMS, Micro-Electro-Mechanical System) principle and process. The pressure sensors of field effect tube type and surface acoustic wave sensing principle can all be mass-produced, miniaturized, integrated and intelligentized by applying MEMS technology. [0003] Various types of pressure sensors have different structures and principles, but they all have one thing in common, that is, the external pressure must be transmitted to the pressure-sensitive element. The media for transmitting external pressure are different and have different physical and chemical characteristics. Pressure sensors must also adapt to environmental requirements. , adopting different pressure transmission designs. For s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L9/06
CPCG01L9/06
Inventor 苏卫国李宋陈广忠张俊辉周刚
Owner 安徽京芯传感科技有限公司
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