A kind of manufacturing method of pcb half-hole slice

Abstract

The invention provides a method for making PCB half-hole slices, comprising the following steps: S1: first, add a layer of protective insulation layer on the hole wall of the PCB template; S2: sample the target hole with the added protective insulation layer, and grind it to Polish after approaching the half-hole; S3: remove the protective insulating layer on the wall of the polished half-hole section; S4: put the half-hole section after removing the protective insulating layer under a scanning electron microscope and other testing equipment for observation and detection to obtain The characteristics or composition information of the half-hole wall can be used to infer the shape of the entire hole wall; the method for manufacturing the PCB half-hole slice of the present invention has a high degree of restoration of the half-hole wall, and can accurately predict the shape of the whole hole wall.

Description

technical field [0001] The invention relates to the field of printed circuit boards (PCBs), in particular to a method for manufacturing PCB half-hole slices. Background technique [0002] In the production process of printed circuit boards, the occurrence and solution of product quality problems and the improvement of the process need to be studied and judged by observing hole slices (PCB half-hole slices), and whether the hole slices are good or bad depends on the How high the degree of restoration of the actual hole wall is is the key factor for judging and studying the quality and process of PCB. Especially for PCB drilling with warp and weft interwoven glass fiber cloth, whether the observed hole wall information is complete and true is the key to in-depth research. [0003] At present, the production of PCB half-hole slices includes the following five steps: sampling, sealing, grinding, polishing and micro-etching. The sample taken is basically plated with copper on t...

AI Technical Summary

Problems solved by technology

The sample taken is basically plated with copper on the hole wall. This method can only observe the morphology of the glass fiber cloth and resin on the grinding surface after drilling (that is, when the half hole is ground, only the half hole groove can be observed. two sides), it is difficult to speculate on the glass fiber cloth and resin drilling of the entire hole wall, and it is impossible to fully reflect the quality information of the hole wall

Of course, at present, there are also half-hole slices that have not undergone the copper-immersion copper plating process, but this method does not protect or isolate the hole wall, and it is easy to cause abrasive debris to adhere to the hole wall or even damage the shape of the hole wall during the grinding process. Affects the reduction degree of the slice hole wall

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