A kind of light-emitting diode and its preparation method

Abstract

The invention discloses a light-emitting diode and a fabrication method thereof. In the light-emitting diode fabricated by the method of the light-emitting diode, steps are arranged on a substrate, afirst type of conductive layer of an epitaxial structure formed on adjacent steps can be at least partially contacted with a second type of conductive layer adjacent to a first direction, so that electrical connection of the first type of conductive layer of the epitaxial structure on adjacent steps and the second type of conductive layer adjacent to the first direction can be achieved by a subsequently-formed transparent conductive layer; and by the mode, automatic series connection of at least two epitaxial structures can be achieved without building a bridge electrode, a breakage risk probably occurring in the bridge electrode is prevented, and moreover, the fabrication difficulty of the light-emitting diode with a plurality of epitaxial structures connected in series is simplified.

Description

technical field [0001] The present application relates to the technical field of semiconductors, and more specifically, to a light emitting diode and a preparation method thereof. Background technique [0002] A light emitting diode (Light Emitting Diode, LED), also called an electroluminescent diode, is a core component of an LED lamp. With the rapid development of light-emitting diodes, the application fields of light-emitting diodes continue to increase, and the structure of light-emitting diodes is also continuously improved and perfected. [0003] Light-emitting diodes with a high-voltage chip structure have become a popular development direction for light-emitting diodes due to their advantages of effectively reducing the cost and energy consumption at the application end. In the prior art, light-emitting diodes using a high-voltage chip structure usually use a chip manufacturing process to realize the series connection of several light-emitting units on a horizontal ...

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Problems solved by technology

However, in this structure, the electrodes realize the bridging electrodes of several light-emitting units in series, which need to bridge the first-type conductive structure and the second-type conductive structure of the two light-emitting units together, and these two conductive structures are not in the same epitaxial On the horizontal plane, it is not only necessary to make multiple isolation layers when preparing bridging electrodes, but also to solve the bridging problem of right-angled sides caused by different height differences, which not only makes the preparation process of bridging electrodes complicated, but also makes bridging electrodes in some It is easy to break at the bend

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