Radio frequency implementation device for super high-speed modem

A modem, ultra-high-speed technology, applied in the field of satellite communication, to solve the problem of demodulation clock recovery, stable and reliable performance, and simple structure

Active Publication Date: 2018-04-17
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Limited by the device bandwidth of the modulator and demodulator and the sampling rate of AD and DA, the single-carrier high-speed data transmission scheme used by the existing high-speed modem can no longer meet the demand

Method used

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  • Radio frequency implementation device for super high-speed modem
  • Radio frequency implementation device for super high-speed modem
  • Radio frequency implementation device for super high-speed modem

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Embodiment Construction

[0014] refer to Figure 1 to Figure 3 , the present invention consists of a first baseband board 1, a second baseband board 2, a third baseband board 3, a first modulation board 4, a second modulation board 5, a third modulation board 6, a modulation clock 7, First reference crystal oscillator 8, combined amplifier 9, split amplifier 10, first demodulation board 11, second demodulation board 12, third demodulation board 13, demodulation clock 14, second reference crystal oscillator 15 , the fourth baseband board 16, the fifth baseband board 17, and the sixth baseband board 18, figure 1 It is the electric principle block diagram of the embodiment of the present invention, and the embodiment is according to figure 1 Connect the lines. Wherein the first reference crystal oscillator 8 provides a 100MHz reference reference signal for the first modulation board 4, the second modulation board 5, the third modulation board 6 and the modulation clock 7, and the second reference cryst...

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Abstract

The invention discloses a radio frequency implementation device for a super high-speed modem, and relates to the radio frequency implementation technology of the super high-speed modem in the field ofsatellite communication. The radio frequency implementation device consists of 3 modulation baseband cards, 3 modulation board boards, a modulation clock, a reference crystal oscillator, a combiningamplifier, a shunting amplifier, a 3 demodulation board cards, a demodulation clock, a reference crystal oscillator and 3 demodulation baseband boards. The radio frequency implementation device uses amulticarrier scheme, the throughput of each path of carriers is 5Gbps, the two paths of carriers can satisfy 10Gbps, and a path of low speed signals is added to restore the clock. The radio frequencyimplementation device disclosed by the invention adopts a modular design, is simple in structure, stable and reliable in performance, can work normally in a bad environment, and is especially suitable for the radio frequency realization of 10Gbps ultra high-speed modems in the satellite communication systems of Q band, V band, W band and terahertz band.

Description

technical field [0001] The invention relates to a radio frequency realization technology of an ultra-high-speed modem in the field of satellite communication, and is particularly suitable for the radio frequency realization of a 10Gbps ultra-high-speed modem in a satellite communication system of a Q frequency band, a V frequency band, a W frequency band and a terahertz frequency band. Background technique [0002] The C-band, Ku-band, and Ka-band resources used by traditional commercial satellites have become saturated, so it is imminent to develop satellite communication technologies in the Q-band, V-band, W-band, and terahertz frequency band. As the bandwidth of satellite communication in the Q-band, V-band, W-band and terahertz frequency band continues to increase, the demand for data transmission is also increasing. Limited by the device bandwidth of the modulator and demodulator and the sampling rate of AD and DA, the existing single-carrier high-speed data transmissio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M11/06
Inventor 李新崔平
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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