Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Processing device for waste integrated objects of computer

A processing device and integrated technology, applied in the field of electrical engineering, can solve the problems of low efficiency, difficulty in energy saving and environmental protection, etc., and achieve the effect of improving processing speed and fine separation, which is convenient and efficient

Inactive Publication Date: 2018-04-20
许伟
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Computer waste aggregates are mainly integrated motherboards and integrated circuit chips, etc. Waste computer aggregates need to be processed. After processing, it is often necessary to separate the resin components and metal components in the aggregates, and then classify and extract different metal components. It is easy to recycle and reuse. In the traditional treatment method, a heating furnace is used to treat it at high temperature to melt the resin components. The aggregate is not crushed before heating. The resin enters the molten state slowly, and some are burned. The traditional treatment The efficiency of the method is low, and it is difficult to meet the requirements of energy saving and environmental protection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Processing device for waste integrated objects of computer
  • Processing device for waste integrated objects of computer
  • Processing device for waste integrated objects of computer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0016] A processing device for computer waste aggregates, as shown in the figure, includes an equal-diameter straight cross pipe 1 and a square frame 2, the equal-diameter straight cross pipe 1 and the square frame 2 are both vertical, and the equal-diameter straight cross pipe 1 Located inside the square frame 2, the equal-diameter straight cross...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a processing device for waste integrated objects of a computer. The processing device comprises an equal-diameter orthogonal four-way pipe and a square frame; the equal-diameter orthogonal four-way pipe and the square frame are vertical; the equal-diameter orthogonal four-way pipe is located inside the square frame and is formed by welding four communicating pipe bodies; arotating shaft is arranged in each communicating pipe body of the equal-diameter orthogonal four-way pipe and is coaxial with the center line of the corresponding communicating pipe where the rotatingshaft is located; round plates are fixedly arranged at the inner ends of the rotating shafts and are perpendicular to the corresponding rotating shafts; connecting blocks are arranged at the outer ends of the rotating shafts; the rotating shafts are movably connected to the corresponding connecting blocks through bearings; the connecting blocks are fixedly connected to the inner side of the square frame through electric telescopic rods; the electric telescopic rod are coaxial with the center lines of the corresponding rotating shafts; a bevel gear is arranged on each communicating pipe body and is movably connected to the corresponding communicating pipe body through a bearing; every two adjacent bevel gears are matched with each other in a meshing mode; and sleeves are fixedly arranged at the outer ends of the bevel gears. The processing device has the advantage that the speed for processing the waste integrated objects of the computer can be increased.

Description

technical field [0001] The invention belongs to the field of electrical engineering, in particular to a device for treating computer waste aggregates. Background technique [0002] Computer waste aggregates are mainly integrated motherboards and integrated circuit chips, etc. Waste computer aggregates need to be processed. After processing, it is often necessary to separate the resin components and metal components in the aggregates, and then classify and extract different metal components. It is easy to recycle and reuse. In the traditional treatment method, it uses a heating furnace to perform high-temperature treatment on it to melt the resin components. The aggregate is not crushed before heating. The resin enters the molten state slowly, and some are burned. The traditional treatment The efficiency of the method is low, and it is difficult to meet the requirements of energy saving and environmental protection. Contents of the invention [0003] The invention provides...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B29B17/04B29B17/02
CPCB29B17/02B29B17/04B29B2017/0255B29B2017/0484Y02W30/62
Inventor 许伟
Owner 许伟
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products