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A method and device for measuring surface topography of a workpiece

A surface topography and workpiece surface technology, applied in the field of measuring the surface topography of workpieces, can solve the problems of unrealistic measurement of surface topography and high cost, and achieve the effect of small measuring range, large measuring range and high precision

Active Publication Date: 2020-08-21
王喆 +1
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Problems solved by technology

[0002] Without the use of other additional imaging technologies, the general technology of super-resolution region below 10nm cannot be realized, and special technology is required, and the cost is high; Theoretical limit) can no longer be measured; while the projection method can only realize the imaging of objects whose surface topography changes greater than 11 μm, based on the existing technology, it is impossible to measure the surface topography of workpieces of conventional sizes

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  • A method and device for measuring surface topography of a workpiece
  • A method and device for measuring surface topography of a workpiece
  • A method and device for measuring surface topography of a workpiece

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Embodiment Construction

[0056] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0057] First, the terms appearing in the present invention are explained: projection imaging is also called projection method. Projection method is a measurement method designed to image the outer contour of an object based on the principle that light can only propagate along a straight line. Simple projection method (not Using any numerical processing process), the imaging accuracy is above 11 μm, and theoretically, the projection method cannot achieve imaging below 11 μm. Holographic imaging, also known as holographic method, is an imaging method that uses photocoupler devices (CCD, etc.) to record holograms. In addition to the imaging function, holographic method can also be used for measurement. The biggest advantage of using hologr...

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Abstract

The invention discloses a method and a device for measuring the surface morphology of a work piece. The method includes the following steps: dividing each surface of a work piece to be measured into aplurality of sub surfaces to be measured; carrying out projection imaging and holographic imaging on each sub surface to be measured; for each sub surface to be measured, obtaining the space positionof the sub surface to be measured according to the projection imaging result of the sub surface to be measured, reproducing the holographic surface morphology at the space position of the sub surfaceto be measured according to the holographic imaging result of the sub surface to be measured and taking the holographic surface morphology as the surface morphology of the sub surface to be measured;stitching the surface morphologies of the sub surfaces to be measured into the surface morphology of the surface where the sub surfaces to be measured are located according to the position relationship between the sub surfaces to be measured on the same surface; and obtaining the surface morphology of the work piece to be measured according to the surface morphology of each surface of the work piece to be measured. The scheme combines the characteristics of large measurement range and low precision of the projection imaging result and the characteristics of small measurement range and high precision of the holographic imaging result, and is suitable for obtaining the surface morphology of a work piece which meets the requirement of measurement.

Description

technical field [0001] The invention relates to the technical field of high-precision measurement, in particular to a method and a device for measuring the surface topography of a workpiece. Background technique [0002] Without the use of other additional imaging technologies, the general technology of super-resolution region below 10nm cannot be realized, and special technology is required, and the cost is high; Theoretical limit) can no longer be measured; while the projection method can only realize the imaging of objects with surface topography changes greater than 11 μm, based on the existing technology, it is impossible to measure the surface topography of workpieces with conventional sizes. Contents of the invention [0003] In view of the above problems, the present invention provides a method and device for measuring the surface topography of a workpiece to solve the above problems or at least partly solve the above problems. [0004] According to one aspect of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/24
CPCG01B11/24G01B11/2433
Inventor 王喆邹如飞
Owner 王喆
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