Pressing block trigger device and epoxy resin vacuum low pressure packaging process method

Abstract

The invention discloses a pressing block trigger device and an epoxy resin vacuum low pressure packaging process method. The device comprises a pressing block, a movable pin and a cylinder. The upperpart of the pressing block has a slide rod, and a front end of the movable pin can be embedded into a dovetail groove in a side of the slide rod. An end of the movable pin is connected to a piston inthe cylinder through a connecting rod, and the moving pin is driven by the movement of the piston to be embedded into the slide rod or withdrawn from the sliding rod. A pre-cured epoxy resin is used as a bonding material, the operation is more convenient than that of a traditional epoxy resin, the cost is lower than that of a soldering mode, and the operating temperature is low and has small damage to the device. A vacuum oven is used to cure epoxy resin, a vacuum/low pressure state in a sealed cavity is ensured, and the formation of sealed interface pores due to internal expansion during curing is avoided. An epoxy resin curing process is designed, vacuumizing is carried out in a preheating stage, the pressing block trigger device is used to control the pressing block to press a cover plate in falling, the discharge of gas inside the cavity is ensured, and the pre-cured epoxy resin can effectively bond.

Description

technical field [0001] The invention relates to an epoxy resin vacuum low-pressure packaging process method, which belongs to the technical field of ceramic shell packaging. Background technique [0002] Traditional ceramic shell packages generally adopt the method of epoxy resin bonding or soldering. Epoxy resin bonding is to pre-coat insulating epoxy resin on the bonding area, place the cover plate on the coated epoxy resin and fix it by clamping, and combine the shell and the cover plate together by heating and curing. Solder soldering is to apply solder paste or place pre-cut soldering sheets on the soldering area in advance, then place the cover plate on the solder paste / solder sheet and fix it, and melt the solder through high temperature, so that the cover plate and the shell are combined. The commonly used solder is gold tin solder. [0003] shortcoming: [0004] Epoxy resin bonding: The epoxy resin material has high fluidity, and it will spread and flow after the...

AI Technical Summary

Problems solved by technology

[0004] Epoxy resin bonding: The epoxy resin material has high fluidity, and it will spread and flow after the cover plate is placed, which will cause the failure of the internal components of the cavity and affect the appearance of the product. When the internal gas expands during heating and curing, air holes will be generated at the bonding interface and th

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