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Wafer cleaning and texturing process

A silicon wafer cleaning and silicon wafer technology, applied in sustainable manufacturing/processing, final product manufacturing, cleaning methods and utensils, etc., which can solve the requirement that the temperature of the texturing solution cannot be guaranteed, the influence of the quality of the silicon wafer, and the easy appearance of water marks Printing and other problems, to achieve the effect of easy process adjustment, uniform heating temperature, and avoiding edge patterns

Active Publication Date: 2019-05-10
LESHAN TOPRAYCELL
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing texturing tanks are not stable enough to control the solution temperature, and cannot guarantee the solution temperature requirements for texturing
[0005] At the same time, in the prior art, although there is a device for continuous silicon wafer cleaning and texturing, during the process of transferring the silicon wafer from the cleaning solution to the texturing tank, the silicon wafer is prone to watermarks due to exposure to the air. As a result, the quality of silicon wafers is affected

Method used

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  • Wafer cleaning and texturing process
  • Wafer cleaning and texturing process
  • Wafer cleaning and texturing process

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Embodiment Construction

[0046] The present invention will be further described below in conjunction with the drawings and embodiments.

[0047] Such as Figure 1 to Figure 6 As shown, the silicon wafer cleaning and texturing process of the present invention uses a silicon wafer cleaning and texturing device, which includes a silicon wafer texturing tank 1, a silicon wafer transfer device 2 and a silicon wafer cleaning device 3; The silicon wafer transfer device 2 is arranged between the silicon wafer texturing tank 1 and the silicon wafer cleaning device 3;

[0048] The silicon wafer texturing tank 1 includes a tank body 11 and a heating controller 19; one end of the tank body 11 is provided with a water inlet tank 12, and the other end is provided with a water outlet tank 13;

[0049] One end of the water inlet tank 12 is communicated with the tank body 11 through a first uniform flow plate 17, and a water inlet tank 14 communicating with the water inlet tank 12 is arranged above the other end; the water ...

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Abstract

The invention discloses a silicon wafer cleaning and texturing process, which can be convenient for texturing temperature control and ensure that a silicon wafer is always in a wet state when the silicon wafer undergoes the silicon wafer cleaning and texturing processes. The silicon wafer cleaning and texturing process is implemented by adopting a silicon wafer cleaning and texturing device. The silicon wafer cleaning and texturing device comprises a silicon wafer texturing trough, a silicon wafer transfer device and a silicon wafer degumming and cleaning device, wherein the silicon wafer transfer device is arranged between the silicon wafer texturing trough and the silicon wafer degumming and cleaning device. The silicon wafer cleaning and texturing process comprises the steps of cleaningand texturing. By adopting the silicon wafer cleaning and texturing process, the texturing temperature control precision is high, the chemical reaction in the entire process trough is stable and controllable, effective control of the reaction speed and volatilization amount of a solution can be realized, and the adjustment of the process is facilitated; and the silicon wafer is sprayed during thetransfer process so as to ensure that the silicon wafer always maintains a wet state during operation, thereby effectively avoiding the occurrence of ''edge scratched wafer'', and improving product quality.

Description

Technical field [0001] The invention relates to the texturing of silicon wafers, in particular to a silicon wafer cleaning and texturing process. Background technique [0002] As we all know: silicon wafers need to be cleaned after a series of processing procedures. The purpose of cleaning is to eliminate all kinds of pollutants adsorbed on the surface of silicon wafers, and to make a suede structure that can reduce the reflection of sunlight on the surface, and clean The degree of cleanliness directly affects the yield and reliability of the cell. Texturing is the first process for manufacturing crystalline silicon cells, also known as "surface texturing". The effective texture structure makes the incident light reflect and refract multiple times on the surface of the silicon wafer, which increases the absorption of light, reduces the reflectivity, and helps improve the performance of the battery. [0003] Taking into account the important role of the texturing process section o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/0236H01L31/18B08B3/04B08B3/08
CPCB08B3/04B08B3/08H01L31/02363H01L31/18Y02P70/50
Inventor 陈五奎刘强耿荣军
Owner LESHAN TOPRAYCELL