Wafer cleaning and texturing process
A silicon wafer cleaning and silicon wafer technology, applied in sustainable manufacturing/processing, final product manufacturing, cleaning methods and utensils, etc., which can solve the requirement that the temperature of the texturing solution cannot be guaranteed, the influence of the quality of the silicon wafer, and the easy appearance of water marks Printing and other problems, to achieve the effect of easy process adjustment, uniform heating temperature, and avoiding edge patterns
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[0046] The present invention will be further described below in conjunction with the drawings and embodiments.
[0047] Such as Figure 1 to Figure 6 As shown, the silicon wafer cleaning and texturing process of the present invention uses a silicon wafer cleaning and texturing device, which includes a silicon wafer texturing tank 1, a silicon wafer transfer device 2 and a silicon wafer cleaning device 3; The silicon wafer transfer device 2 is arranged between the silicon wafer texturing tank 1 and the silicon wafer cleaning device 3;
[0048] The silicon wafer texturing tank 1 includes a tank body 11 and a heating controller 19; one end of the tank body 11 is provided with a water inlet tank 12, and the other end is provided with a water outlet tank 13;
[0049] One end of the water inlet tank 12 is communicated with the tank body 11 through a first uniform flow plate 17, and a water inlet tank 14 communicating with the water inlet tank 12 is arranged above the other end; the water ...
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