Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

4results about How to "Easy process adjustment" patented technology

A silver layer-based migration-resistant terminal plating layer and a preparation method thereof

PendingCN122279695Aevenly dispersedNo risk of short circuitNanoparticleSilver ion
This invention provides a silver-based terminal coating with high migration resistance, relating to the field of terminal coating preparation technology. The coating, from the inside out, comprises a copper alloy substrate, a nickel underlayer, a composite silver layer, and a gold protective layer. The nickel underlayer is formed by electroplating with a nickel plating solution containing nickel sulfamate, nickel chloride, and boric acid. Through the synergistic effect of nanoparticle surface modification treatment, pulse co-deposition process, and interface optimization technology, the nanoparticles are uniformly dispersed in the composite silver layer and form a stable bond with the coating. Combined with the protective system formed by the dual-pulse gold plating process, the migration path of silver ions is blocked from the source, ensuring that the terminal has no short-circuit risk under long-term use and harsh environments, and significantly improving the product's service life and reliability.
Owner:DONGGUAN YICHUANG SURFACE TREATMENT TECH CO LTD

Surface defect detection method and device, electronic equipment and storage medium

This disclosure provides a surface defect detection method, apparatus, electronic device, and storage medium. The method includes parsing an image to be inspected based on a texture analysis model to obtain a token set and a reconstructed image, and determining a residual map between the two. Residual features are extracted from the residual map, and a residual anomaly score of the image to be inspected is determined based on the residual features. The shape, scale, orientation, and position of all tokens in the token set are statistically analyzed to obtain token statistical features, and a batch anomaly score of the image to be inspected is determined based on the token statistical features. Based on the residual anomaly score and the batch anomaly score, the surface defect detection result of the product to be inspected is determined and output. The surface defect detection result includes attribution explanation information. This method can accurately detect weak-contrast large-scale muras, reducing the false negative rate of muras, and can also provide traceable anomaly attribution information to facilitate process adjustments.
Owner:ZHONGJIA MICROVISION (SHENZHEN) SEMICONDUCTOR TECHNOLOGY CO LTD

Surface pseudo-defect detection method and device, electronic equipment and storage medium

The present disclosure provides a surface pseudo-defect detection method and device, electronic equipment and storage medium. The method comprises: determining a token statistical feature based on a to-be-detected image of a to-be-tested product; determining a token sample statistical feature based on sample images of multiple normal products in the same batch and / or the same process window; establishing a batch normal model based on the token sample statistical feature; establishing a pseudo-defect detection model based on the token sample statistical feature and sample meta-information corresponding to the multiple normal products; determining a batch abnormality score and an optical consistency score of the to-be-detected image based on the batch normal model, the pseudo-defect detection model, the token statistical feature and meta-information of the to-be-tested product; and determining a detection result of the to-be-tested product based on the batch abnormality score and the optical consistency score and outputting the detection result. The method can reduce the false detection rate of Mura and also provide traceable abnormality attribution information to facilitate process adjustment.
Owner:ZHONGJIA MICROVISION (SHENZHEN) SEMICONDUCTOR TECHNOLOGY CO LTD

High specific gravity tungsten alloy and method for producing the same

PendingCN122588434ASolve the problem of insufficient matching of strength and toughnesshigh density
The application belongs to the technical field of tungsten alloy preparation, and discloses a high specific gravity tungsten alloy and a preparation method thereof, which is composed of the following components in percentage by mass: 88% to 92% of tungsten, 4% to 6% of nickel, 1.5% to 2.5% of iron, 0.05% to 0.2% of zirconium, 0.1% to 0.3% of lanthanum oxide, and the balance of inevitable impurities; the alloy is prepared by using zirconium hydride as a zirconium source, cooperating with lanthanum oxide doping modification, and sequentially passing through powder mixing and ball milling, cold isostatic pressing forming, degreasing, solid phase pre-sintering and liquid phase sintering processes, and does not need additional complex post-treatment. The high specific gravity tungsten alloy has excellent matching of strength and toughness, and the tensile strength and elongation are obviously improved compared with conventional alloys of the same type; tungsten phase grains are small and uniform, and the grain boundary bonding strength is high; the preparation process is safe and controllable, and the cost is low; the high specific gravity tungsten alloy can be adapted to the weight matching, protection and other service requirements of various high-end equipment.
Owner:ZHUZHOU JIUDING METAL TECH CO LTD