Mass transfer method of micro devices

Abstract

The invention provides a mass transfer method of micro devices. The method comprises steps of: 1) capturing a micro device by using an entire photosensitive material; 2) making the photosensitive material into a trapezoidal structure and a supporting micro column by using the micro device as a photolithographic mask plate; 3) breaking the supporting micro column by using mechanical force to achieve the mass transfer of the micro devices. The entire photosensitive material is used to catch the micro devices so as to avoid the insufficient alignment accuracy of catching the micro devices. The method uses the micro device as the photolithographic mask plate and makes the photosensitive material into the trapezoidal structure and the supporting micro column so as to be beneficial to the stability of the micro device and the simplicity of subsequent separation. The mass transfer of the micro devices can be achieved just by breaking the supporting micro column with mechanical force. The method is simple in process and can reduce process cost.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, in particular to a mass transfer method of micro components. Background technique [0002] Micro-component technology refers to an array of micro-sized components integrated at high density on a substrate. At present, micro-pitch light-emitting diode (Micro LED) technology has gradually become a research hotspot, and the industry expects high-quality micro-component products to enter the market. High-quality fine-pitch light-emitting diode products will have a profound impact on traditional display products such as LCD / OLED that are already on the market. [0003] In the process of fabricating the micro-components, the micro-components are first formed on the donor packaging substrate, and then transferred to the receiving packaging substrate. The receiving package substrate is, for example, a display screen. One difficulty in the fabrication of microcomponents is how to transfer the...

AI Technical Summary

Problems solved by technology

[0008] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a mass transfer method of micro-elements, which is used to solve the problem of complicated micro-element transfer process and low yield in the prior art

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