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Mass Transfer Method for Micro Components

A transfer method and micro-component technology, which is applied in the field of mass transfer of micro-components, can solve the problems of complex micro-component transfer process and low yield rate, and achieve the effects of improving transfer yield rate, reducing process cost, and facilitating simplicity

Active Publication Date: 2019-07-05
HUBEI SANAN OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a mass transfer method of micro-elements, which is used to solve the problem of complicated micro-element transfer process and low yield in the prior art

Method used

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  • Mass Transfer Method for Micro Components
  • Mass Transfer Method for Micro Components
  • Mass Transfer Method for Micro Components

Examples

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Embodiment Construction

[0040] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0041] see Figure 1 to Figure 10 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, so that only the components related to the present invention are shown in the diagrams rather than the number, shape and Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual implementation, and th...

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Abstract

The present invention provides a mass transfer method of micro-components, comprising the steps of: 1) grabbing the micro-components by using the whole surface photosensitive material; column; 3) using mechanical force to crush the supporting micro-pillar to realize the mass transfer of the micro-element. The present invention uses the entire surface of the photosensitive material to grab the micro-components, which can avoid the problem of insufficient grasping and alignment accuracy of the micro-components; the present invention uses the micro-components as a photolithographic mask to make the photosensitive material into a trapezoidal structure and support micro-pillars, It is beneficial to the stability of micro-components and the simplicity of subsequent separation; the present invention only needs to use mechanical force to break the supporting micro-pillars to realize the mass transfer of micro-components, the process is simple, and the process cost can be effectively reduced.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, in particular to a mass transfer method of micro components. Background technique [0002] Micro-component technology refers to an array of micro-sized components integrated at high density on a substrate. At present, micro-pitch light-emitting diode (Micro LED) technology has gradually become a research hotspot, and the industry expects high-quality micro-component products to enter the market. High-quality fine-pitch light-emitting diode products will have a profound impact on traditional display products such as LCD / OLED that are already on the market. [0003] In the process of fabricating the micro-components, the micro-components are first formed on the donor packaging substrate, and then transferred to the receiving packaging substrate. The receiving package substrate is, for example, a display screen. One difficulty in the fabrication of microcomponents is how to transfer the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68H01L21/683H01L33/00
CPCH01L33/005H01L21/68H01L21/6835H01L2221/68368H01L2221/68381H01L25/167H01L2224/95H01L21/52H01L33/0093H01L33/0095
Inventor 钟志白李佳恩郑锦坚郑建森徐宸科康俊勇
Owner HUBEI SANAN OPTOELECTRONICS CO LTD
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