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Micro LED preparation method

A horizontal direction, grain technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., to achieve the effect of solving precise alignment, improving transfer rate and production yield

Active Publication Date: 2019-09-17
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above problems, the purpose of the present invention is to provide a preparation method of Micro LED to solve the problem that the traditional mass transfer in the Micro LED manufacturing process must require precise alignment

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Embodiment Construction

[0034] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that these embodiments may be practiced without these specific details.

[0035] Aiming at the problem that the existing massive transfer in the Micro LED manufacturing process must require precise alignment, resulting in a decrease in transfer rate and production yield, the present invention provides a Micro LED manufacturing method to solve the above problems.

[0036] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0037] In order to illustrate the Micro LED preparation method provided by the present invention, figure 1 The process flow of the Micro LED manufacturing method according to the embodiment of the present invention is shown.

[0038] like figure 1 As shown, the Micro LED prepar...

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Abstract

The invention provides a method for preparing a Micro LED. The method comprises arranging grooves on a backplane to fit LED dies; scattering the LED dies on the surface of the backplane and shaking the backplane in the horizontal direction to make the LED dies fall into the matching grooves; blowing away the LED dies that do not fall into the grooves by using an airflow in the horizontal directionof the backplane; solidifying the LED dies that fall into the grooves and the backplane; removing the protective films of the LED dies by a dehumidifying method; providing a reflective filling layerin the gaps between the LED dies and the grooves; photoetching the surface of the tops of the LED dies in order that the tops of the LED dies expose a dosage concentration conductive layer, planarizing the conductive layer and then bonding electrodes. The method can solve the problem that mass transfer in a conventional manufacturing process of the Micro LED requires precise alignment.

Description

technical field [0001] The present invention relates to the technical field of semiconductor optoelectronics, and more specifically, to a method for preparing a Micro LED. Background technique [0002] Micro LED technology, that is, LED miniaturization and matrix technology, has the advantages of good stability, lifespan, and operating temperature, and also inherits the advantages of LED low power consumption, color saturation, fast response speed, and strong contrast. MicroLEDs are 30 times brighter than OLEDs and consume about 10% of the power of LCDs and 50% of OLEDs. [0003] Micro LED will have great application prospects in the future, but the current manufacturing cost of Micro LED has seriously affected its commercialization process. The main reason is that the bottleneck of mass transfer technology still needs to be broken through. Traditional mass transfer often requires precise alignment. This puts strict requirements on the production cost and manufacturing envi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/52H01L33/60H01L33/62H01L33/00
Inventor 牛小龙翁守正徐相英孙龙洋姜晓飞
Owner GOERTEK INC
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