Insulation heat dissipation treatment system of hardware element of intelligent equipment

Abstract

The invention relates to an insulation heat dissipation treatment system of a hardware element of intelligent equipment. The insulation heat dissipation treatment system comprises a base chamber, anda treatment chamber is mounted at the upper part of the base chamber; a left bearing pillar and a right bearing pillar are separately mounted on the left and right sides of the treatment cavity; a topplate is connected to the upper parts of the left bearing pillar and the right bearing pillar; a motor is mounted in the middle position of the base cavity; a motor shaft is connected to the upper part of the motor; a rotating platform is connected to the upper part of the motor shaft; a left storage chamber and a right storage chamber are separately mounted on the left and right sides of the upper part of the rotating platform; a left air blower and a right air blower are separately mounted at the upper part of the left side of the left bearing pillar and the upper part of the right side ofthe right bearing pillar; and air supply chambers are connected to the right side of the left air blower and the left side of the right air blower. The insulation heat dissipation treatment system caneffectively aim at insulation treatment for the hardware element of intelligent equipment, a chip is conveniently treated, heat dissipation treatment is conveniently carried out according to requirements, and the insulation heat dissipation treatment effect is improved.

Description

technical field [0001] The invention belongs to the technical field of intelligent equipment hardware components, and in particular relates to an insulation and heat dissipation processing system for intelligent equipment hardware components. Background technique [0002] When smart chips are stored, they will be affected by dust in the air. These dusts will be adsorbed on the circuit board to form charged dust that can be found or not found by the naked eye, resulting in reduced insulation and poor contact. In severe cases, it will cause a short circuit and damage the chip. Therefore, smart chips need to be stored in a suitable environment to reduce the influence of external environmental factors. Contents of the invention [0003] The object of the present invention is to provide an insulation and heat dissipation treatment system for smart device hardware components, so as to better improve the processing effect of the smart device hardware components and improve the u...

AI Technical Summary

Problems solved by technology

These dusts will be adsorbed on the circuit board to form charged dust that can be found or not found by the naked eye, resulting in reduced insulation and poor contact. In severe cases, it will cause a short circuit in the circuit and damage the chip.