A kind of led packaging structure

Abstract

The invention relates to an LED packaging structure, which comprises a packaging substrate (21), an LED chip fixedly connected to the packaging substrate (21), and a silica gel layer. The silica gel layer comprises a first silica gel layer (22) and a second silica gel layer (24), wherein the first silica gel layer (22) and the second silica gel layer (24) are sequentially arranged on the upper surface of the LED chip. A plurality of spherical lenses (23) are also arranged between the first silica gel layer (22) and the second silica gel layer (24). The second silica gel layer (24) contains yellow fluorescent powders. According to the invention, a plurality of spherical lenses are arranged and yellow fluorescent powders are arranged on the second silica gel layer. Therefore, the illumination is more concentrated. The cost of additional lenses is avoided, and the production cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of photoelectric devices, and in particular relates to an LED packaging structure. Background technique [0002] LED has the characteristics of long life, high luminous efficiency, good color rendering, safety and reliability, rich colors and easy maintenance. Against the backdrop of increasingly serious environmental pollution, climate warming and increasingly tense energy sources, semiconductor lighting technology developed based on high-power LEDs has been recognized as one of the most promising high-tech fields in the 21st century. After , incandescent and fluorescent lamps, a great leap in the history of human lighting has rapidly improved the quality of lighting in human life. [0003] The demand for LEDs has been increasing over the past few years, especially high brightness and high power LEDs. However, although high-brightness and high-power LEDs can generate a lot of light, they also generate a l...

AI Technical Summary

Problems solved by technology

However, although high-brightness and high-power LEDs can generate a lot of light, they also generate a lot of heat. The high temperature makes the quantum efficiency of the phosphor powder directly coated on the chip surface significantly reduced, which seriously affects the LED packaging structure. Lumen efficiency

[0004] On the other hand, because the light emitted by the LED light source is generally distributed in a divergent manner, the illumination brightness of the light source is not concentrated enough. In the prior art, the light beam is generally shaped by adding an external lens, which increases the production cost.

Images