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Flexible substrate and preparation method thereof

A flexible substrate and flexible substrate technology, applied in semiconductor/solid-state device manufacturing, photovoltaic power generation, electrical components, etc., can solve the problems of easy thermal expansion, bending, and warping of glass, so as to avoid rapid curing and avoid bending , the effect of uniform speed

Active Publication Date: 2018-05-04
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The inventors of the present application found in the long-term research process that the polyimide material used in the flexible polyimide substrate is a liquid material, which needs to be cured at high temperature. Flexible substrates are prone to bending, warping, etc.

Method used

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  • Flexible substrate and preparation method thereof
  • Flexible substrate and preparation method thereof
  • Flexible substrate and preparation method thereof

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Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0016] refer to figure 1 , figure 1 It is a schematic flow chart of an embodiment of the method for preparing a flexible substrate of the present invention. The preparation method of the flexible substrate provided by the embodiment of the present invention includes:

[0017] Step S101, vacuum drying the glass substrate coated with the wet film of the flexible substrate material to remove part of the solvent in the wet film of the flexible su...

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Abstract

The invention discloses a flexible substrate and a preparation method thereof. The preparation method comprises the steps of carrying out vacuum drying on a glass substrate coated with a flexible substrate material wet film to remove one part of solvent in the flexible substrate material wet film; and curing and forming the flexible substrate material subjected to vacuum drying, wherein the curingand forming temperature is matched with the vacuum drying temperature. According to the flexible substrate and the preparation method thereof, the phenomena, such as bending and warping of the glasssubstrate can be effectively avoided.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a flexible substrate and a preparation method thereof. Background technique [0002] The flexible display method is a method of preparing devices on the surface of a flexible substrate made of flexible materials. With the development and progress of science and technology, bendable flexible devices made of flexible substrates will become mainstream devices for next-generation optoelectronic devices. Flexible devices such as displays, chips, circuits, power supplies, and sensors can achieve functions that traditional optoelectronic devices cannot achieve, and have the advantages of low cost or good user experience. [0003] Taking flexible AMOLED as an example, the flexible substrate needs to be prepared or adsorbed on the surface of the hard substrate first, and the flexible substrate needs to be peeled off from the hard substrate after the device is prepared. The thickness of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L27/32
CPCH10K77/111H10K2102/311Y02E10/549
Inventor 王选芸
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD