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A kind of preparation method of hollow inner buried blind groove heat dissipation plate

A built-in, blind slot technology, which is applied in the direction of circuit heating devices, circuit fluid transportation, printed circuit components, etc., can solve the problems that cannot meet the design of micro-motor systems, and achieve the effect of continuous product effect

Active Publication Date: 2020-06-23
珠海杰赛科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The above products all need to use circuit board modules. At present, the circuit board products that mainly meet the heat dissipation effect in the industry mostly conduct heat through aluminum-based, copper-based and other metal substrates to achieve the purpose of heat dissipation. The common metal substrates on the market can no longer meet the requirements. Complex Design of MEMS

Method used

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  • A kind of preparation method of hollow inner buried blind groove heat dissipation plate
  • A kind of preparation method of hollow inner buried blind groove heat dissipation plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] This embodiment provides a hollow embedded blind slot heat dissipation printed circuit board, which includes a printed circuit board body, such as figure 1 As shown, it is a twelve-layer board structure. A certain depth of the multi-layer board is an embedded layer 3, a rigid board 1 is above the buried layer, and a rigid board 2 is below the buried layer. The buried layer 3 It is composed of a prepreg 31 - a light plate 32 - a prepreg 33 interlayer. The embedded layer 3 is embedded with a micro flow channel groove 5, which is a blind groove. The micro-channel groove 5 is provided with a liquid inlet hole and a liquid outlet hole 6 penetrating the rigid plate 1 up to the top surface of the printed circuit board, and cooling liquid enters the micro-channel groove from the liquid inlet hole. , overflowing from the liquid outlet hole. The microchannel groove 5 is a horizontal groove. The liquid inlet hole and the liquid outlet hole 6 are respectively opened at both ends ...

Embodiment 2

[0050] This embodiment is similar to Embodiment 1, the difference is that, as figure 2 As shown, the upper layer board 10 and the lower layer board 20 are both single-sided boards, and the embedded layer 30 does not include a bare board, but only includes a layer of Tenghui VT-47PP. In the figure, the microchannel blind groove is 50, and 60 is a liquid inlet or liquid outlet. In the preparation method of the printed circuit board, the preparation step of the light board is not included, and in the process of preparing the blind groove of the one or more laminated Tenghui VT-47PP, there is no need to consider the Tenghui VT-47PP The indentation of the groove relative to the edge of the blind groove of the bare board.

[0051] When the height of the buried layer is not high, the structure of Example 2 or the multi-layer laminated Tenghui VT-47PP can be used. Regardless of whether the upper and lower boards are multi-layer boards or single / double-layer boards, the structure of...

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Abstract

The invention provides a preparation method of a hollow embedded blind-slot cooling printed circuit board. An embedded layer is added in the traditional printed circuit board at certain depth, a blindslot serving as a coolant microflow channel slot is formed in the embedded layer, the top and the bottom of the blind slot are both abutted against rigid layers of the printed circuit board, a plurality of blind holes communicated with the blind slot are formed in the printed circuit board and comprise cooling holes filled with cooling substances as well as a liquid inlet hole and a liquid outlethole, and a coolant enters from the liquid inlet hole, overflows from the liquid outlet hole and takes heat away. The cooling blind slot is arranged in the printed circuit board prepared with the method, appearance is not affected, the cooling effect is lasting and stable, and the method is a major breakthrough in the technical field of printed circuit boards. The method is simple, feasible and suitable for popularization.

Description

technical field [0001] The invention relates to the field of preparation of a printed circuit board, in particular to a printed circuit board with a heat sink buried inside and a preparation method thereof. Background technique [0002] In recent years, with the continuous development of micro-motor systems, heat transfer and flow at the micro-scale have received widespread attention. It has super heat transfer effects, better safety, no leakage, and cooling effects of flowing liquids. it is good. It has stimulated people's interest in the study of microfluidic properties, and microchannels have been widely used in the manufacture of heat exchangers, heat generators, printer nozzles, reactant transport and particle separation, and have great development prospects. [0003] The above products all need to use circuit board modules. At present, the circuit board products that mainly meet the heat dissipation effect in the industry mostly conduct heat through aluminum-based, co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0201H05K1/0272H05K2201/064
Inventor 吴传亮杨杰段斌李超谋
Owner 珠海杰赛科技有限公司