PCB of preventing separating of hole walls, and processing technology thereof

Abstract

The invention relates to a PCB of preventing separating of hole walls. The PCB of preventing separating of hole walls is characterized in that the PCB of preventing separating of hole walls includes aPCB body; a plurality of mutually parallel conductive copper layers and PTH holes are formed in the PCB body 1; the PTH holes are perpendicular to the conductive copper layers; copper plates are arranged on the hole walls of the PTH holes; a plurality of hole rings are fixedly at the outer side of each copper plate, and the hole rings encircle the copper plate; and the hole rings are embedded into the PCB body. The PCB of preventing separating of hole walls can effectively avoid the copper plates separating from hole walls of the PTH holes by increasing the hole rings.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a PCB board for preventing hole wall separation. Background technique [0002] Hole wall separation is a defect in which the copper plating layer of the plated through hole is separated from the PCB body during the heat treatment of PCB and PCBA (hot air leveling tin, thermal shock, reflow soldering), etc. Once it occurs, it will bury the PCB downstream. Hidden danger. Once a PCB manufacturer or its downstream customers find that the hole wall is separated, they will always scrap or return the whole batch, which will directly cause huge economic losses to the PCB manufacturer. What is more serious is that it is often accompanied by High claims for electronics manufacturers. Now that the thickness of PCB is getting thicker and thicker, the probability of hole wall separation also increases accordingly. Contents of the invention [0003] Based on this, it is necessary to provide ...

AI Technical Summary

Problems solved by technology

[0002] Hole wall separation is a defect in which the copper plating layer of the plated through hole is separated from the PCB body during the heat treatment of PCB and PCBA (hot air leveling tin, thermal shock, reflow soldering), etc. Once it occurs, it will bury the PCB downstream. Hidden danger

Once a PCB manufacturer or its downstream customers discover the phenomenon of hole wall separation, they will always scrap or return the whole batch, which will directly cause huge economic losses to the PCB manufacturer. What's more, it is often accompanied by High claims of electronic manufacturers

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