Manufacturing technology of printed circuit board with leveled line and base material

Abstract

The invention discloses a manufacturing technology of a printed circuit board with leveled line and base material. The manufacturing technology comprises the following steps: external line primary etching-line glue filling-board glue coating-drilling-hole metallization-external line secondary etching-post-processing (including solder resist, character, gong board and other processes). According tothe manufacturing technology, the processes of line glue filling and board glue coating are mainly additionally arranged in manufacturing of the circuit board and overall copper plating of the circuit board is performed after drilling, then copper layer thickening is independently performed on the hole wall with the plated copper through the graphic electroplating mode to complete hole metallization, and finally external line secondary etching is performed to remove the thin copper layer on the substrate plane so that the printed circuit board with the leveled line and base material can be obtained, the manufacturing technology can be used for manufacturing the special printed circuit board current collecting ring, the electric brush head is enabled to be simultaneously contacted with thebase material and the copper surface, excessive wearing of the copper surface can be avoided, the durability of the product can be enhanced and the requirement for long-time and high-intensity working of the current collecting ring can be met.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a manufacturing process of a printed circuit board in which the circuit is flush with the base material. Background technique [0002] The traditional disc collector ring uses the more common copper protruding circuit board (such as figure 1 shown), when the disc collector ring is required, the raised copper surface of the circuit board on the disc collector ring is exposed, so that the exposed raised copper surface 8 is in contact with the brush head 6 for a long time. increase, the raised copper surface 8 of the circuit board on the disc collector ring will wear and tear, resulting in a decrease in the electrical connection performance of the circuit board of the disc collector ring, which will easily lead to damage to the disc collector ring and reduce the disc The service life of the circuit board in the type collector ring, and it is difficult to meet the r...

AI Technical Summary

Problems solved by technology

[0002] The traditional disc collector ring uses the more common copper protruding circuit board (such as figure 1 shown), when a disc collector ring is required, the raised copper surface of the circuit board on the disc collector ring is exposed, so that the exposed raised copper surface 8 is in contact with the brush head 6 for a long time, and with the use time increase, the raised copper surface 8 of the circuit board on the disc collector ring will wear and tear, resulting in a decrease in the electrical connection performance of the circuit board of the disc collector ring, which will easily lead to damage to the disc collector ring and reduce the disc The service life of the circuit board in the type collector ring, and it is difficult to meet the requirements for long-term high-strength work of the collector ring

Images