Method and electronic device for forming an electrical connection between an electronic chip and a carrier substrate

Abstract

The present disclosure relates to methods and electronic devices for forming electrical connections between an electronic chip and a carrier substrate. The electrical connection lines connect the electrical connection pads of the electronic chip to the electrical connection pads of the carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds the bond wires and covers at least a portion of the electronic chip and the carrier substrate. A liquid conductive material is deposited on the dielectric layer and then hardens to form a localized conductive shield around the dielectric layer at the bond wire.

Description

[0001] priority claim [0002] This application claims the benefit of priority from French Patent Application No. 1660622, filed November 3, 2016, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0003] Embodiments relate to the field of electronic devices and more particularly to those electronic devices comprising an electronic chip mounted on a carrier substrate comprising an electrical connection network or a lead frame and electrical connection lines connecting the chip to the carrier substrate. Background technique [0004] In the case of electrical connecting lines which carry signals, especially at high frequencies, these signals can be attenuated or destroyed by surrounding electromagnetic fields and / or emit electromagnetic fields which can damage the surrounding environment. [0005] Currently, in order to deal with this problem, it is proposed to add a metal shielding plate, potentially connected to ground, to the ele...

AI Technical Summary

Problems solved by technology

Nonetheless, positioning such metal shields and electrically connecting them to ground, combined with making the encapsulation block or putting the encapsulation lid in place, is problematic and expensive

Furthermore, since the shielding obtained is non-specific and located at a distance from the electrical connection lines, the level of electromagnetic protection obtained is still insufficient

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