Unlock instant, AI-driven research and patent intelligence for your innovation.

Leadless package with non-collapsible bump

A lead-free, device-free technology, applied in electrical components, electro-solid devices, semiconductor devices, etc., can solve problems such as high cost and extra process

Inactive Publication Date: 2018-05-11
NEXPERIA BV
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additional protective molding can be included on sidewalls to prevent leaks, but adding protective molding requires additional process and higher cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Leadless package with non-collapsible bump
  • Leadless package with non-collapsible bump
  • Leadless package with non-collapsible bump

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] now refer to Figure 1 to Figure 3 , shows a semiconductor device 100 according to a first embodiment of the present invention. Semiconductor device 100 has a top surface 102 , a bottom surface 104 , and a plurality of sidewalls 106 disposed between top surface 102 and bottom surface 104 . According to the present embodiment, the semiconductor device 100 is a two-terminal device such as a Schottky diode. The semiconductor device 100 includes two connection pads 108 formed on the bottom surface 104 .

[0018] Each of the connection pads 108 has a stepped design, wherein each connection pad 108 includes a connection portion 112 and a step or protrusion 114 . The connection portion 112 serves as a terminal of the semiconductor device 100 , and the connection portion 112 is electrically connected to an internal circuit of the semiconductor device 100 (ie, a Schottky diode). For WLCSP devices, the connection pads are printed or deposited onto the wafer during wafer fabric...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a leadless package with a non-collapsible bump. The leadless package semiconductor device has a top surface, a bottom surface opposite to the top surface, and multiple sidewalls between the top and bottom surfaces. At least one connection pad is disposed on the bottom surface. The connection pad includes a connection portion and at least one protrusion portion that extendsfrom the connection portion and away from the bottom surface such that the protrusion portion and the connection portion surround a space on the bottom surface.

Description

technical field [0001] The present invention relates generally to leadless packages for semiconductor devices, and more particularly to a bump design that eliminates solder creep to the sidewalls of the device. Background technique [0002] Leadless semiconductor device packages are becoming increasingly popular. A leadless package has no leads extending beyond the body of the device, thereby reducing the overall size of the semiconductor device. In contrast, leadless devices typically connect to the outside through pads or solder balls on one of their surfaces, improving electrical and thermal performance at the solder points where the device is attached to a printed circuit board (PCB). [0003] Leadless packages are particularly useful in wafer level chip scale packaging (WLCSP). Typically, a WLCSP has external connection-like pads or solder balls formed on one of its surfaces prior to dicing. The size of the resulting packaged device is not much larger than the semico...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/872H01L23/49
CPCH01L23/49H01L29/872H01L2224/10145H01L2224/13015H01L23/3114H01L24/13H01L24/16H01L24/81H01L2224/13017H01L2224/13019H01L2224/13023H01L2224/131H01L2224/14051H01L2224/141H01L2224/1601H01L2224/16238H01L2224/81193H01L2224/81815H01L2924/3841H01L2224/13011H01L2924/384H01L24/14H01L2924/014H01L2924/00014H01L24/09H01L2224/1701
Inventor 周伟煌周安乐
Owner NEXPERIA BV