Check patentability & draft patents in minutes with Patsnap Eureka AI!

Methods for depositing conformal BCN films

A processing method and technology of boron carbide film, applied in the field of carbon boron nitride film and/or boron nitride film to form boron carbide film, can solve the problems of reducing film shape retention

Pending Publication Date: 2018-05-11
APPLIED MATERIALS INC
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, high temperature limits the application of such films, and plasma treatment reduces the conformality of the film due to the distribution of the plasma

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Methods for depositing conformal BCN films

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0008] As used in this specification and the appended claims, the terms "substrate" and "wafer" are used interchangeably, both referring to a surface, or portion of a surface, upon which a process acts. Those skilled in the art will also understand that references to a substrate may also refer to only a portion of a substrate unless the context clearly dictates otherwise.

[0009] Reference throughout this specification to "one embodiment," "certain embodiments," "various embodiments," "one or more embodiments," or "an embodiment" means that particular features described in connection with the embodiment , structures, materials or characteristics may be included in at least one embodiment of the present disclosure. Furthermore, appearances of phrases such as "in one or more embodiments," "in certain embodiments," "in one embodiment," or "in an embodiment" throughout the specification are not intended to All refer to the same embodiment of the present disclosure. In addition,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Methods for forming a borocarbide film on a substrate surface by exposing the substrate surface to a borane precursor. The borocarbide film optionally comprising nitrogen and / or hydrogen. The borocarbide film can be deposited onto a surface that comprises substantially no boron. The borane precursor can include compound having the general formula NHR2BH3, where each R is independently selected from the group consisting of hydrogen, C1-C10 alkyl groups, C1-C10 alkenyl groups and aryl groups.

Description

technical field [0001] Embodiments of the present disclosure generally relate to methods of forming boron carbide films. More specifically, embodiments of the present disclosure relate to methods of forming boron carbide films, boron carbonitride films, and / or boron nitride films. Background technique [0002] Due to strong covalent bonds, the elements boron, carbon, and nitrogen form B-C-N materials with many useful properties. For example, the material may be formed to have high hardness, high temperature stability, enhanced reactive ion etching (RIE) selectivity, and / or enhanced solvent etchant resistance. Efforts have focused on diamond-like carbon (DLC) films, boron carbide films, and boron nitride films. Research has also focused on ternary compounds such as BCN. [0003] Conventional processes use high temperature chemical vapor deposition (CVD) at temperatures greater than about 550° C. or use plasma enhanced CVD. However, high temperature limits the application ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/04H01L21/02C23C16/32C23C16/36C23C18/12
CPCC23C16/32C23C16/36H01L21/04C23C16/342C23C18/1204H01L21/02115H01L21/02274H01L21/02527H01L21/0262H01L21/0405
Inventor 程睿A·B·玛里克
Owner APPLIED MATERIALS INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More