Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Mold, manufacturing method of organic light emitting diode, and organic light emitting diode

A technology of light-emitting diodes and manufacturing methods, which are applied in electroluminescent light sources, semiconductor/solid-state device manufacturing, light sources, etc., can solve problems such as unavailability of organic semiconductor layers, and achieve low-cost effects

Active Publication Date: 2020-05-26
OJI HLDG CORP
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there is a problem that when the base is processed to form a two-dimensional lattice structure, the organic semiconductor layer formed on the base cannot be formed by the coating method described in Patent Document 2.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mold, manufacturing method of organic light emitting diode, and organic light emitting diode
  • Mold, manufacturing method of organic light emitting diode, and organic light emitting diode
  • Mold, manufacturing method of organic light emitting diode, and organic light emitting diode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] Hereinafter, each configuration will be described using the drawings. In the drawings used in the following description, the characteristic parts may be enlarged for convenience to understand the characteristics, and the dimensional ratio of each component may not necessarily be the same as the actual situation. Materials, dimensions, and the like illustrated in the following description are examples, and the present invention is not limited to such materials and dimensions, and can be appropriately changed and implemented within a range that does not change the gist.

[0051] "mold"

[0052] figure 1 It is a perspective view which schematically shows the mold of one aspect of this invention. In the mold 10 according to one aspect of the present invention, a plurality of flat surfaces 1 a to 1 n and a plurality of convex portions 2 a to 2 n are provided on the main surface 10A. The plurality of flat surfaces 1 a to 1 n are arranged in a region surrounded by the most ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
aspect ratioaaaaaaaaaa
thicknessaaaaaaaaaa
aspect ratioaaaaaaaaaa
Login to View More

Abstract

The invention relates to a mold, a method for manufacturing an organic light emitting diode and the organic light emitting diode. The mold has a flat surface and a plurality of protrusions on the main surface, the average pitch of the plurality of protrusions is 50 nm to 5 μm, the average aspect ratio of the plurality of protrusions is 0.01 to 1, and among the plurality of protrusions More than 80% have a specific curved surface, and the specific curved surface deviates from the first point by only 1 / 10 of the average pitch by setting an arbitrary point on the specific curved surface as the first point When the point of is set as the second point, the inclination angle of the second tangent plane connected to the second point with respect to the first tangent plane connected to the first point is within 60°.

Description

technical field [0001] The invention relates to a mold, a method for manufacturing an organic light emitting diode and the organic light emitting diode. This application claims priority based on Japanese Patent Application No. 2015-178324 for which it applied in Japan on September 10, 2015, and uses the content here. Background technique [0002] Organic light-emitting diodes are light-emitting elements that utilize organic electroluminescence. An organic light emitting diode generally has a structure in which an anode and a cathode are respectively provided on both surfaces of an organic semiconductor layer including a light emitting layer containing an organic light emitting material. The organic semiconductor layer includes an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, and the like as necessary, in addition to the light emitting layer. Organic light emitting diodes have advantages such as less viewing angle dep...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05B33/10B29C33/42B29C59/02H01L51/50H05B33/02
CPCB29C33/42B29C59/02H10K71/00H05B33/02H05B33/10H10K50/00
Inventor 本乡弘毅篠塚启
Owner OJI HLDG CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com