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Chip polishing device for data cable manufacturing factory

A polishing device and a technology of a manufacturing plant, which are applied in the direction of manufacturing tools, grinding drive devices, grinding/polishing equipment, etc., can solve the problems of poor polishing effect and low polishing efficiency, and achieve the effect of reducing workload and improving work efficiency

Inactive Publication Date: 2018-05-15
刘云龙
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the shortcomings of poor polishing effect and low polishing efficiency of existing polishing equipment, the technical problem to be solved by the present invention is to provide a polishing equipment with good polishing effect and high polishing efficiency

Method used

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  • Chip polishing device for data cable manufacturing factory
  • Chip polishing device for data cable manufacturing factory
  • Chip polishing device for data cable manufacturing factory

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A chip polishing device for a data line manufacturing plant, such as Figure 1-5 As shown, it includes a bottom plate 1, a storage box 2, a baffle plate 3, a polishing mechanism 4, a left and right moving mechanism 5 and a mounting frame 6; the mounting frame 6 is fixed on the top of the bottom plate 1; Between the bottom plate 1, it is used to adjust the horizontal position of the chip; the storage box 2 is fixedly connected to the output end of the left and right moving mechanism 5, and the baffle plate 3 is fixedly connected to the top of the storage box 2 at equal intervals; the polishing mechanism 4 is fixedly connected to the inner wall of the installation frame 6 , and the output end of the polishing mechanism 4 is located above the placement box 2 for polishing the chip.

Embodiment 2

[0030] A chip polishing device for a data line manufacturing plant, such as Figure 1-5 As shown, it includes a bottom plate 1, a storage box 2, a baffle plate 3, a polishing mechanism 4, a left and right moving mechanism 5 and a mounting frame 6; the mounting frame 6 is fixed on the top of the bottom plate 1; Between the bottom plate 1, it is used to adjust the horizontal position of the chip; the storage box 2 is fixedly connected to the output end of the left and right moving mechanism 5, and the baffle plate 3 is fixedly connected to the top of the storage box 2 at equal intervals; the polishing mechanism 4 is fixedly connected to the inner wall of the installation frame 6 , and the output end of the polishing mechanism 4 is located above the placement box 2 for polishing the chip.

[0031]The left and right moving mechanism 5 includes a first slide rail 51, a first slide block 52, a connecting rod 53, a fixed block 54, a first pole 55, a second slide block 56, a rack 57, ...

Embodiment 3

[0033] A chip polishing device for a data line manufacturing plant, such as Figure 1-5 As shown, it includes a bottom plate 1, a storage box 2, a baffle plate 3, a polishing mechanism 4, a left and right moving mechanism 5 and a mounting frame 6; the mounting frame 6 is fixed on the top of the bottom plate 1; Between the bottom plate 1, it is used to adjust the horizontal position of the chip; the storage box 2 is fixedly connected to the output end of the left and right moving mechanism 5, and the baffle plate 3 is fixedly connected to the top of the storage box 2 at equal intervals; the polishing mechanism 4 is fixedly connected to the inner wall of the installation frame 6 , and the output end of the polishing mechanism 4 is located above the placement box 2 for polishing the chip.

[0034] The left and right moving mechanism 5 includes a first slide rail 51, a first slide block 52, a connecting rod 53, a fixed block 54, a first pole 55, a second slide block 56, a rack 57,...

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PUM

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Abstract

The invention relates to a chip polishing device, in particular to a chip polishing device for a data cable manufacturing factory. The chip polishing device aims to achieve good polishing effect and high polishing efficiency. The chip polishing device for the data cable manufacturing factory comprises a bottom plate and the like; a left-and-right moving mechanism is used for adjusting the horizontal position of a chip; a placement box is fixedly connected to the output end of the left-and-right moving mechanism, and baffles are fixedly connected to the top of the placement box at equal intervals; and a polishing mechanism is fixedly connected to the inner side wall of a mounting frame, the output end of the polishing mechanism is located above the placement box, and the polishing mechanismis used for polishing the chip. According to the chip polishing device for the data cable manufacturing factory, the left-and-right moving mechanism, the polishing mechanism and a material pushing mechanism cooperate with one another, so that the effects of good polishing effect and high polishing efficiency are achieved.

Description

technical field [0001] The invention relates to a chip polishing device, in particular to a chip polishing device for a data line manufacturing plant. Background technique [0002] A chip generally refers to the carrier of an integrated circuit, and is also the result of the design, manufacture, packaging, and testing of an integrated circuit. It is usually an independent whole that can be used immediately. [0003] Polishing refers to the use of mechanical, chemical or electrochemical action to reduce the surface roughness of the workpiece to obtain a bright and smooth surface. It is a modification process on the surface of the workpiece by using polishing tools and abrasive particles or other polishing media. [0004] The existing polishing equipment has the disadvantages of poor polishing effect and low polishing efficiency, so it is urgent to develop a polishing equipment with good polishing effect and high polishing efficiency. Contents of the invention [0005] (1)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B24B41/00B24B41/06B24B47/20
CPCB24B29/02B24B41/005B24B41/06B24B47/20
Inventor 刘云龙
Owner 刘云龙
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