High-temperature-resistant organic-inorganic composite bar planting adhesive for wood structure and preparation method of high-temperature-resistant organic-inorganic composite bar planting adhesive

Abstract

The invention discloses a high-temperature-resistant organic-inorganic composite bar planting adhesive for a wood structure and a preparation method of the high-temperature-resistant organic-inorganiccomposite bar planting adhesive. The high-temperature-resistant organic-inorganic composite bar planting adhesive is prepared from a component A and a component B by mixing, wherein the component A comprises raw materials in parts by weight as follows: 100 parts of epoxy resin E51, 50 parts of waterborne epoxy resin, 5-10 parts of a DBP flexibilizer and a KH550 coupler; the component B comprisesraw materials in parts by weight as follows: 50 parts of a modified amine JH5-55 curing agent, 70-100 parts of cement, 50 parts of quartz sand, 100 parts of silica powder and 10-20 parts of carbon fiber powder. The high-temperature-resistant organic-inorganic composite bar planting adhesive has the characteristics of high adhesive force, stable volume, excellent durability, low cost, high-temperature resistance (for a long time at 150 DEG C) and the like, is large in bond stress for reinforcing steel bars and has excellent anti-seismic, anti-shock and fatigue-resistant properties.

Description

technical field [0001] The present invention relates to a wood structure reinforcement glue and a preparation method thereof, in particular to a wood structure organic-inorganic composite anchoring reinforcement glue and a preparation method thereof, which can be industrially produced, have good bonding performance, can withstand a high temperature of 150°C, and are inexpensive . Background technique [0002] Anchor planting glue belongs to building structure glue. From the material composition, anchor planting glue can be divided into organic type planting glue and inorganic type planting glue. At present, the commonly used planting glue in the market is organic type planting glue . [0003] At present, there are two types of organic type planting glue commonly used, one is epoxy resin type planting glue, and the other is polyurethane high-performance resin glue. Organic planting glue has its remarkable advantages, such as high early strength and mature development, etc.,...

AI Technical Summary

Problems solved by technology

[0004] (1) Defects in physical and chemical properties such as poor heat and humidity resistance, easy aging, toxicity, and high price;

[0005] (2) The construction conditions are strict and cannot be constructed at too low or too high temperature

It is not easy to solidify at low temperature; it is easy to denature at high temperature, and it is difficult to realize the welding process after planting at the construction site, which increases the difficulty of construction, etc.

[0006] (3) The operating temperature range is narrow, and it cannot be constructed and used at too low or too high temperature

If it is used at low temperature (0°C and below), it is easy to become brittle; if it is used at high temperature (100°C and above) for a long time, it is easy to denature and the mechanical properties will decrease;

[0007] As a result, inorganic type anchoring and planting glue came into being. At present, most of the inorganic type planting glue on the market is cement-based inorganic planting glue. The advantages of high temperature, no aging, and similar elastic modulus to concrete are widely used in concrete structure planting bars. However, because the base material wood will absorb water greatly during the curing process of cement-based inorganic planting bars, which will affect the strength of cement-based inorganic planting bars. Poor bonding with wood base material, not suitable for direct use in wood structure reinforcement

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