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Ultrasonic transducer device, ultrasonic probe, and ultrasonic apparatus

一种超声波、换能器的技术，应用在超声波换能器器件领域，能够解决难以辨认、超声波图像不明确等问题

Active Publication Date: 2018-05-25
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the noise component is large, it becomes difficult to recognize because the ultrasound image becomes unclear

Method used

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  • Ultrasonic transducer device, ultrasonic probe, and ultrasonic apparatus
  • Ultrasonic transducer device, ultrasonic probe, and ultrasonic apparatus
  • Ultrasonic transducer device, ultrasonic probe, and ultrasonic apparatus

Examples

Experimental program
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Effect test

no. 1 approach

[0076] In this embodiment, a characteristic example of an ultrasonic transducer device and a method of manufacturing the ultrasonic transducer device will be described with reference to the drawings. according to Figure 1 to Figure 23 , and the ultrasonic transducer device according to the first embodiment will be described.

[0077] figure 1 is a schematic plan view showing the configuration of the ultrasonic transducer device. Such as figure 1 As shown, the ultrasonic transducer device 1 includes a first substrate 2 and a second substrate 3 . A manner in which the second substrate 3 overlaps the first substrate 2 is formed.

[0078] The first substrate 2 is rectangular with two adjacent sides orthogonal to each other. The direction in which one side extends is the X direction, and the direction in which the sides adjacent to each other in the X direction extend is the Y direction. Let the thickness direction of the first substrate 2 be the Z direction.

[0079] The l...

no. 2 approach

[0162] Next, use Figure 24 A schematic side sectional view of main parts showing the configuration of the ultrasonic transducer device will be described to describe an embodiment of the ultrasonic transducer device. This embodiment differs from the first embodiment in that a through-hole is provided in a portion of the second substrate 3 facing the ultrasonic element 8 . In addition, descriptions of the same points as those in the first embodiment are omitted.

[0163] That is, according to this embodiment, if Figure 24As shown, in the ultrasonic transducer device 44, the first substrate 2 and the second substrate 45 are overlapped. Furthermore, in the second substrate 45 , a through-hole 46 is provided at a portion facing the ultrasonic element 8 . The ultrasonic wave 33 transmitted in the +Z direction by the ultrasonic element 8 can travel in the +Z direction through the through-hole 46 .

[0164] Then, the reflected wave 34 traveling toward the ultrasonic element 8 fr...

no. 3 approach

[0166] Next, use Figure 25 and Figure 26 , an embodiment of the ultrasonic transducer device will be described. Figure 25 It is a schematic side sectional view of main parts showing the configuration of the ultrasonic transducer device. Figure 26 It is a schematic plan view of main parts showing the configuration of the ultrasonic transducer device. This embodiment differs from the first embodiment in that wiring corresponding to the second wiring 7 is provided inside the first chassis 11 . In addition, descriptions of the same points as those in the first embodiment are omitted.

[0167] That is, according to this embodiment, if Figure 25 As shown, the ultrasonic transducer device 50 includes a base substrate 51 . The ultrasonic elements 8 constituting the ultrasonic element unit 9 are arranged side by side on the base substrate 51 . The ultrasonic elements 8 on the left side in the figure are the first element 8a and the third element 8c, and the ultrasonic elemen...

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PUM

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Abstract

The invention provides an ultrasonic transducer device, an ultrasonic probe, and an ultrasonic apparatus. An ultrasonic transducer device includes a first substrate that is provided with a plurality of ultrasonic transducer elements arranged in a matrix, and a plurality of first wires via which the ultrasonic transducer elements are electrically connected to each other as a plurality of serial sets, and a second substrate that is provided to overlap the first substrate, and is provided with a plurality of second wires intersecting the first wires in a plan view from a thickness direction of the first substrate and third wires via which the first wires are electrically connected to the second wires.

Description

technical field [0001] The invention relates to an ultrasonic transducer device, an ultrasonic detector and an ultrasonic device. Background technique [0002] Ultrasound devices that transmit ultrasonic waves inside a subject and generate ultrasonic images using the ultrasonic waves reflected from the inside of the subject are widely used. The reflected ultrasonic waves are converted into electrical signals by the ultrasonic transducer device. A plurality of ultrasonic transducer elements are provided in the ultrasonic transducer device. The electrical signal output by the ultrasonic transducer device is a weak signal, which is amplified and used by the amplifier circuit. [0003] When the amplification factor of the amplifier circuit is increased, not only signal components but also noise components are amplified. When the noise component is large, the ultrasonic image becomes unclear and difficult to see. If the electrical signal output by the ultrasonic transducer ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B8/00
CPCA61B8/4444A61B8/4483A61B8/56G01S15/8925G01S7/52079B06B1/0607
Inventor 鹤野次郎
Owner SEIKO EPSON CORP
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