Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Laser and its preparation method

A laser and grating technology, applied in the field of semiconductor lasers, can solve the problems of reducing the output wavelength stability, low efficiency and high cost of the laser, achieve the effects of good single-mode output spectrum, reduce manufacturing costs, and simplify the process flow

Active Publication Date: 2020-01-24
HISENSE BROADBAND MULTIMEDIA TECH
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the particle direct writing method (such as EBL) usually used at present to prepare the phase shift grating has slow speed, low efficiency and high cost, and the phase shift grating will cause serious uneven distribution of the light field inside the laser chip, which will cause serious problems. Spatial hole burning effect reduces the stability of the output wavelength of the laser

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laser and its preparation method
  • Laser and its preparation method
  • Laser and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details being omitted, or other methods, components, devices, steps, etc. may be adopted. In other instances, well-known technical solution...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
etching poweraaaaaaaaaa
refractive indexaaaaaaaaaa
Login to View More

Abstract

The present disclosure relates to a semiconductor laser, and provides a laser and a manufacturing method thereof. The laser includes: a substrate; an active layer located on the substrate; a grating layer located on the active layer, and the grating layer Comprising a uniform grating with a first duty ratio located in a first area and a uniform grating with a second duty ratio located in a second area, the first area is adjacent to the second area; The uniform grating with a duty cycle and the uniform grating with the second duty cycle can transmit light of the same wavelength. On the one hand, the overlap of light wavelengths transmitted by two gratings with different duty ratios is used, so that the lasing wavelength of the laser can obtain the lowest threshold gain and a good single-mode output spectrum. On the other hand, the holographic exposure process is adopted without changing Uniform gratings with different duty ratios are realized by changing the etching process, avoiding the use of expensive phase shift technology, simplifying the process flow and reducing the manufacturing cost.

Description

technical field [0001] The present disclosure relates to semiconductor lasers, in particular to a laser and a method for preparing the laser. Background technique [0002] In optical fiber communication, semiconductor lasers are widely used in the field of optical communication due to their advantages of small size, high efficiency, low power consumption, and easy integration. However, due to their single-mode output and narrow output spectrum, semiconductor lasers effectively reduce the power consumption of light in optical fibers. The dispersion broadening caused by medium transmission is suitable for high-speed modulation and long-distance optical fiber communication applications. [0003] At present, after the anti-reflection coating is coated on both ends of the uniform grating laser, there will be two degenerate longitudinal waves with the same gain. When the two ends have asymmetric coatings, this gain will be eliminated, because the laser wavelength depends on the R...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/068G02B5/18
CPCG02B5/1857H01S5/068
Inventor 尚飞
Owner HISENSE BROADBAND MULTIMEDIA TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products