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Separated test connection plate

A test connection and separation technology, applied in the field of signal transmission, can solve problems such as test board breakage, unfavorable stable transmission of test signals, signal interruption, etc., to reduce replacement costs, solve unstable test signal transmission, and improve test efficiency. Effect

Inactive Publication Date: 2018-05-29
豪威半导体(太仓)有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The test signal transmission of the existing CMOS test equipment starts from the chip end of the test equipment, through the contacts of the PCB board, the signal transmission is carried out in the form of pressing pins, and the test signal of the chip is transmitted to the test main board on the test board. The test digital signal is processed by the test board on the test board to judge whether the chip is good or not; During the next test, some lifting and pressing actions need to be completed, and the test board will also passively complete the lifting and pressing actions, which will not be conducive to the stable transmission of test signals, and it is prone to signal interruptions, and may even cause test failures. plate fracture

Method used

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  • Separated test connection plate

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[0015] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0016] A separate test connection board according to the present invention includes a test board 1 , a connection line 2 and a needle presser board 3 , and the test board 1 is connected to the needle presser board 3 through the connection line 2 . In order to facilitate the disassembly and installation of the connection line 2, the test board 1 is detachably connected to the connection line 2, and the needle press plate 3 is detachably connected to the connection line 2. Preferably, the test board 1 is connected to the connection line 2 through a slot, and the needle press The board 3 is connected ...

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Abstract

The invention discloses a separated test connection plate. The separated test connection plate includes a test plate body, a connection wire and a pressing plate; the test plate body is connected withthe pressing plate through the connection wire, the connection wire is an FPC, the test plate body is detachably connected with the connection wire, and the pressing plate is detachably connected with the connection wire. The separated test connection plate is simple in structure and smartly designed, and the problems are solved that signal transmission tests are unstable and signals easily interrupt; the connection wire is detachably connected, so that the production cost is saved.

Description

technical field [0001] The invention relates to the field of signal transmission, in particular to a separate test connection board. Background technique [0002] The test signal transmission of the existing CMOS test equipment starts from the chip end of the test equipment, through the contacts of the PCB board, the signal transmission is carried out in the form of pressing pins, and the test signal of the chip is transmitted to the test main board on the test board. The test digital signal is processed by the test board on the test board to judge whether the chip is good or not; During the next test, some lifting and pressing actions need to be completed, and the test board will also passively complete the lifting and pressing actions, which will not be conducive to the stable transmission of test signals, and it is prone to signal interruptions, and may even cause test failures. Breakage of the board. Contents of the invention [0003] Aiming at the defects in the pri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04G01R31/26
Inventor 张俊堂方正嵇杰方俊勇李海峰
Owner 豪威半导体(太仓)有限公司