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A High Reliability Schottky Contact Super Barrier Rectifier

A technology of super barrier rectification and Schottky contact, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of large forward voltage drop and low forward surge reliability of devices, and achieve good electrical performance and thermal stability, good forward surge reliability capability

Active Publication Date: 2020-05-01
CHONGQING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Various Schottky contact super barrier rectifiers in the prior art, due to the existence of the Schottky contact, make the device have no conductance modulation effect under high current conditions, but can only rely on majority carrier conduction, so that the large current The forward voltage drop under the condition is very large, which leads to the low forward surge reliability capability of the device

Method used

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  • A High Reliability Schottky Contact Super Barrier Rectifier
  • A High Reliability Schottky Contact Super Barrier Rectifier
  • A High Reliability Schottky Contact Super Barrier Rectifier

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] like figure 2 As shown, a high reliability Schottky contact super barrier rectifier is characterized by comprising a lower electrode layer 10, a heavily doped first conductivity type substrate layer 20, a lightly doped first conductivity type epitaxial layer 30, Two conductivity type injection structures 41 , Schottky contact super-barrier rectifier cell sequence and upper electrode layer 90 .

[0029] The heavily doped first conductive type substrate layer 20 covers the lower electrode layer 10 .

[0030] The lightly doped first conductive type epitaxial layer 30 covers the heavily doped first conductive type substrate layer 20 .

[0031] The second conductive type implant structure 41 covers a part of the surface of the lightly doped first conductive type epitaxial layer 30 .

[0032] The Schottky contact super-barrier rectifier element package sequence covers part of the surface above the lightly doped first conductivity type epitaxial layer 30 .

[0033] The upp...

Embodiment 2

[0040] like figure 2 As shown, a high reliability Schottky contact super barrier rectifier is characterized by comprising a lower electrode layer 10, a heavily doped first conductivity type substrate layer 20, a lightly doped first conductivity type epitaxial layer 30, Two conductivity type injection structures 41 , Schottky contact super-barrier rectifier cell sequence and upper electrode layer 90 .

[0041] The heavily doped first conductive type substrate layer 20 covers the lower electrode layer 10 .

[0042] The lightly doped first conductive type epitaxial layer 30 covers the heavily doped first conductive type substrate layer 20 .

[0043] The second conductive type implant structure 41 covers a part of the surface of the lightly doped first conductive type epitaxial layer 30 .

[0044] The Schottky contact super-barrier rectifier element package sequence covers part of the surface above the lightly doped first conductivity type epitaxial layer 30 .

[0045] The upp...

Embodiment 3

[0052] like figure 2 As shown, a high reliability Schottky contact super barrier rectifier is characterized by comprising a lower electrode layer 10, a heavily doped first conductivity type substrate layer 20, a lightly doped first conductivity type epitaxial layer 30, Two conductivity type injection structures 41 , Schottky contact super-barrier rectifier cell sequence and upper electrode layer 90 .

[0053] The heavily doped first conductive type substrate layer 20 covers the lower electrode layer 10 .

[0054] The lightly doped first conductive type epitaxial layer 30 covers the heavily doped first conductive type substrate layer 20 .

[0055] The second conductive type implant structure 41 covers a part of the surface of the lightly doped first conductive type epitaxial layer 30 .

[0056] The Schottky contact super-barrier rectifier element package sequence covers part of the surface above the lightly doped first conductivity type epitaxial layer 30 .

[0057] The upper...

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Abstract

The invention discloses a high-reliability Schottky contact super barrier rectifier which is characterized by comprising a heavily-doped first conductive type substrate layer, a lightly-doped first conductive type epitaxial layer and a second conductive type injection structure, a Schottky contact super barrier rectifier element package sequence and an upper electrode layer. The high-reliability Schottky contact super barrier rectifier comprises the injection structure and the Schottky contact super barrier rectifier element sequence. The high-reliability Schottky contact super barrier rectifier belongs to the type of a super barrier rectifier, the Schottky contact super barrier rectifier element package sequence part can enable the device to obtain good electrical performance and thermalstability, and the injection structure part can enable the device to obtain better forward surge reliability capability.

Description

technical field [0001] The invention relates to the technical field of power semiconductor power electronic devices, in particular to a high-reliability Schottky contact super barrier rectifier. Background technique [0002] Rectifiers are widely used in various power electronic devices. PIN power rectifier and Schottky barrier rectifier are two basic structures of power semiconductor rectifiers. [0003] Among them, the PIN power rectifier has a large forward voltage drop, a long reverse recovery time, but a small leakage current and excellent high temperature stability, which is mainly used in the medium and high voltage range. Schottky barrier rectifiers are mainly used in the medium and low voltage range. They have small forward voltage drop and short reverse recovery time, but have high reverse leakage current and poor high temperature reliability. Junction Barrier Controlled Rectifiers (JBS) and Hybrid PIN / Schottky Rectifiers (MPS), which combine the advantages of PI...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/06H01L29/861H01L29/872
CPCH01L29/0634H01L29/8613H01L29/872
Inventor 陈文锁廖瑞金
Owner CHONGQING UNIV