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Heat conduction adhesive tape and production method thereof

A production method and tape technology, which can be applied in the directions of adhesives, film/sheet-like adhesives, pressure-sensitive films/sheets, etc., can solve the problem of easy bending of thermally conductive tapes.

Inactive Publication Date: 2018-06-01
ZHANGJIAGANG KANGDE XIN OPTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to provide a thermally conductive adhesive tape and its manufacturing method, to solve the problem that the thermally conductive adhesive tape made of thicker copper foil is easy to bend in the prior art

Method used

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  • Heat conduction adhesive tape and production method thereof
  • Heat conduction adhesive tape and production method thereof
  • Heat conduction adhesive tape and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] This embodiment provides a thermally conductive tape whose structure is as figure 2 As shown, it includes the second heat-conducting metal layer, the resin base layer, the first heat-conducting metal layer, the pressure-sensitive adhesive layer and the release film from bottom to top. Concrete preparation process is as follows:

[0054] Preparation of thermally conductive masterbatch: 5 parts of copper powder (parts by weight, the same below), 2 parts of carbon nanotubes, and 100 parts of PET masterbatch, mixed in a twin-screw extruder (extruder temperature: 300 ° C, screw speed 80r / min), extruded, granulated to form a thermally conductive masterbatch. 10 parts of thermally conductive masterbatch, 100 parts of PET masterbatch (equivalent to about 0.6 parts of thermally conductive filler in 100 parts of PET), extruded by twin-screw extruder, biaxially stretched (longitudinal stretching ratio: 4 times, transverse stretching Ratio: 3.5 times), corona (5000V / m 2 ), wind...

Embodiment 2

[0061] This embodiment provides a thermally conductive tape whose structure is as figure 2 As shown, it includes the second heat-conducting metal layer, the resin base layer, the first heat-conducting metal layer, the pressure-sensitive adhesive layer and the release film from bottom to top. Concrete preparation process is as follows:

[0062] Preparation of thermally conductive masterbatch: 5 parts of copper powder (parts by weight, the same below), 2 parts of carbon nanotubes, and 100 parts of PET masterbatch are mixed in a twin-screw extruder, extruded, and granulated to form a thermally conductive masterbatch . 10 parts of heat-conducting masterbatch and 100 parts of PET masterbatch are extruded by a twin-screw extruder, biaxially stretched, corona, and wound to obtain a resin base layer.

[0063] Evaporate metal copper on both sides of the resin base layer, and the upper and lower layers of copper plating are both Get a thermal layer.

[0064] A pressure-sensitive a...

Embodiment 3

[0069] This embodiment provides a thermally conductive tape whose structure is as figure 2 As shown, it includes the second heat-conducting metal layer, the resin base layer, the first heat-conducting metal layer, the pressure-sensitive adhesive layer and the release film from bottom to top. Concrete preparation process is as follows:

[0070] Preparation of thermally conductive masterbatch: 5 parts of copper powder (parts by weight, the same below), 2 parts of carbon nanotubes, and 100 parts of PET masterbatch are mixed in a twin-screw extruder, extruded, and granulated to form a thermally conductive masterbatch . 10 parts of heat-conducting masterbatch and 100 parts of PET masterbatch are extruded by a twin-screw extruder, biaxially stretched, corona, and wound to obtain a resin base layer.

[0071] Evaporate metal copper on both sides of the resin base layer, and the upper and lower layers of copper plating are both Get a thermal layer.

[0072] A pressure-sensitive a...

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Abstract

The invention provides a heat conduction adhesive tape and a production method thereof. The heat conduction adhesive tape comprises a heat conduction layer and a pressure-sensitive adhesive layer disposed on one side surface of the heat conduction layer, the heat conduction layer comprises a resin-base layer and a first heat conduction metal layer, the resin-base layer comprises a resin matrix andheat conduction packing dispersed in the resin matrix; and the first heat conduction metal layer is arranged on the surface of one side, close to the pressure-sensitive adhesive layer, of the resin-base layer. The heat conduction layer comprises a resin-base layer and a first heat conduction metal layer, and the resin-base layer comprises a resin matrix and heat conduction packing dispersed in the resin matrix. The bending resistance of the heat conduction layer and the heat conduction adhesive tape can be improved by utilizing the resin-base layer, the heat conduction packing dispersed in the resin matrix can enable the resin-base layer to have high heat conduction performance, so that the first heat conduction metal layer can be thinned, the heat dissipation performance can be compensated, and the heat conduction adhesive tape has good bending resistance and heat conduction performance by combining the first heat conduction metal layer with good heat conduction performance.

Description

technical field [0001] The invention relates to the technical field of adhesive tapes, in particular to a thermally conductive tape and a manufacturing method thereof. Background technique [0002] OLED (Organic Light Emitting Diode) technology has been widely used in the display field of mobile phones, and the penetration of OLED technology in mobile phones is increasing year by year. [0003] At present, in the production of OLED screens, glass or polyimide is usually used as the base layer, but due to the poor thermal conductivity of glass or PI, it is often necessary to increase heat dissipation measures. Existing heat dissipation measures for OLED screens mainly adopt the method of pasting a heat-conducting tape behind the screen. The traditional heat-conducting tape often adopts the method of coating pressure-sensitive adhesive (PSA) on copper foil, that is, a pressure-sensitive adhesive layer is coated on a copper foil with a thickness of about 9 μm to form a heat-co...

Claims

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Application Information

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IPC IPC(8): C09J7/25C09J7/50C09J7/38C08L67/00C08K3/08C08K7/24
CPCC08K3/08C08K7/24C08K2003/085C08K2201/011C09J2203/318C09J2301/122C09J2301/302C09J2301/312C09J2301/41C09J2400/166C09J2467/00C08L67/00
Inventor 李长顺
Owner ZHANGJIAGANG KANGDE XIN OPTRONICS MATERIAL
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