Copper-based composite and preparation method thereof

Abstract

The invention provides a preparation method of a copper-based composite. The preparation method comprises the steps as follows: copper powder, zirconium tungstate powder and barium strontium titanatepowder are provided and mixed, and first mixed powder is obtained; the first mixed powder is subjected to ball milling with a dry ball milling method, and second mixed powder is obtained; the second mixed powder is subjected to first reduction heat treatment, and third mixed powder is obtained; the third mixed powder is subjected to cold isostatic pressing, and a first block is obtained; the firstblock is subjected to hot press sintering, and a second block is obtained; the second block is rolled. The dry powder mixing process is used, so that the powder mixing efficiency and powder mixing effect are improved. The reduction process is designed specially, so that powder oxidized in the powder mixing process can be accurately reduced to the original state while oxide powder cannot be reduced and the oxygen content in oxide cannot deviate from the ideal value. The common hot press sintering method is used, the technology is simple and mature, and the cost is low.

Description

technical field [0001] The invention relates to the field of low thermal expansion alloys, in particular to a copper-based composite material and a preparation method thereof. Background technique [0002] Copper is one of the most widely used materials in the current industrial field. It has long attracted the attention of the material field with its low thermal expansion coefficient, high electrical conductivity and excellent thermal conductivity. As the matrix of metal matrix composites, compared with aluminum, copper has better mechanical properties, higher melting point and better electrical and thermal conductivity. Although the density of copper is higher than that of aluminum, these properties are enough to make copper more than aluminum. It is more favored by industries such as electronic packaging. [0003] As we all know, the field of electronic packaging has the following general requirements for packaging materials: the thermal expansion coefficient should be r...

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Problems solved by technology

[0004] In response to such requirements, the current prior art has developed a copper-based composite material containing barium strontium titanate, which has the advantages of low thermal expansion coefficient, good processability, and strong thermal conductivity, but the applicant is still working on it During the research, it was found that such a copper-based composite material has at least the following defects: 1. In order to avoid the problem of oxidation during the powder mixing process, the method of wet ball milling was used, which resulted in prolonged ball milling time and poor powder mixing effect; 2. 1. Wet ball milling cannot solve the problem of powder oxidation very well. Slight oxidation of powder will also cause the thermal expansion coefficient and mechanical properties of the finished product to deviate from the ideal value; 3. Use spark plasma sintering process, which is not yet mature and the equipment The price is high, and the size of the finished product is strictly limited, which is not suitable for industrial production; 4. The rolling process has not been optimized and is too complicated; 5. The composition of the powder is too simple, which leads to an increase in the thermal expansion coefficient of the rolled plate. In order to restore the thermal expansion Coefficient, but also annealing heat treatment for the rolled plate, which ultimately makes the material processing process very complicated

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