30results about How to "Low expansion properties" patented technology

Disclosed is a fiber-reinforced composite resin composition which can be used as a sealing agent, an adhesive or a filler, specifically a fiber-reinforced composite resin composition which has low thermal expansion, high strength light weight and high thermal conductivity at such levels that have been required recently, particularly which has a high isotropic thermal conductivity at a satisfactory level. The composition comprises a fiber having an average fiber diameter of 4 to 200 nm. When the composition is cured in a plate-like shape, the cured product has a total light transmittance of 70% or higher per 50 [mu]m thickness as measured at an wavelength of 400 to 700 nm and thermal conductivities both in a thickness-wise direction and a plane-wise direction of 0.4 W / m. K or higher. In the cured product, the fiber is oriented randomly.

The present invention aims to provide an electrode mixture which shows little change in viscosity even after 24 hours from the preparation of the mixture and enables production of an electrode having a high electrode density and excellent flexibility and is capable of giving excellent electric properties to the resulting cell. The present invention relates to an electrode mixture including a powdery electrode material; a binder; and an organic solvent, the binder including polyvinylidene fluoride and a fluorine-containing polymer including a polymer unit based on vinylidene fluoride and a polymer unit based on tetrafluoroethylene, the fluorine-containing polymer including the polymer unit based on vinylidene fluoride in an amount of 80.0 to 90.0 mol % based on all the polymer units, the polyvinylidene fluoride having a number average molecular weight of 150,000 to 1,400,000.

Disclosed is a fiber-reinforced composite resin composition which can be used as a sealing agent, an adhesive or a filler, specifically a fiber-reinforced composite resin composition which has low thermal expansion, high strength light weight and high thermal conductivity at such levels that have been required recently, particularly which has a high isotropic thermal conductivity at a satisfactory level. The composition comprises a fiber having an average fiber diameter of 4 to 200 nm. When the composition is cured in a plate-like shape, the cured product has a total light transmittance of 70% or higher per 50 [mu]m thickness as measured at an wavelength of 400 to 700 nm and thermal conductivities both in a thickness-wise direction and a plane-wise direction of 0.4 W / m. K or higher. In the cured product, the fiber is oriented randomly.

The invention provides a package substrate which comprises a copper heat sink plate. Two insulating belts are inlaid on the copper heat sink plate, and the copper heat sink plate is divided into three areas, respectively an electrode area, a welding belt area and an electrode area by the two insulating belts. Tungsten-copper alloy bosses used for fixing light-emitting diode (LED) chips are welded on the welding belt area, and electroplated layers are respectively arranged on the tungsten-copper alloy bosses and the surfaces of the two electrodes. The package substrate is simple in structure, capable of simplifying manufacturing process of the package substrate and greatly reducing manufacturing cost of an LED package substrate. Installation height of the LED chip in a lamp is increased by the tungsten-copper alloy bosses, and therefore light emitted by the LED chips can directly light on working faces of package lenses. The problem that a light extracting rate can be influenced by bonding glue of lenses of a traditional ceramic substrate is solved, and a light emitting rate of an LED bead is increased.

The invention provides a flip-chip substrate which comprises a copper heat sink plate. An insulating tape is embedded in the copper heat sink plate, and the copper heat sink plate is divided into two electrodes by the insulating tape; and tungsten-copper alloy bosses for fixing LED (Light Emitting Diode) chip are respectively welded on the two electrodes, and electroplating layers are arranged on the surfaces of the tungsten-copper alloy bosses. The flip-chip substrate is simple in structure, the manufacturing process flow of the substrate is simplified, and the production cost is greatly lowered; the installation height of the LED chips in a lamp can be enhanced by the tungsten-copper alloy bosses, so that more light emitted from the LED chips can be perpendicularly incident on the working surface of a packaged lens, and the problem that an adhesive for the lens of the conventional ceramic substrate influences a light out-coupling efficiency is solved; and furthermore, the positive and negative poles of the LED chips are directly and conductively connected with the tungsten-copper alloy bosses, a gold wiring process of the conventional process is avoided, and thus the packaging process flow of the LED chips can be further simplified.

The invention discloses a preparation method of a low-expansion high-temperature-resistant adhesive, relating to an adhesive and a preparation method thereof. The invention aims to solve the problems of low heat-resistant level of the existing silicone resin adhesive, complex technological conditions required for the formation of glued joints, poor high-temperature stability and poor thermal shock resistance of the glued joints. The adhesive includes silicone resin, silane coupling agent, curing agent, high temperature resistant filler, inorganic fiber and organic solvent. Method: 1. Dissolve the first part of silicone resin in an organic solvent, then add methyltriethoxysilane, stir to obtain component A; 2. Dissolve the second part of silicone resin in an organic solvent, add water, silane Coupling agent, high temperature resistant filler, reaction, drying under reduced pressure to obtain surface-modified filler, after drying, mixed by planetary ball mill; 3. Mix modified filler, curing agent and inorganic fiber to obtain component B; 4. 1. Mix component A and component B to obtain a low-expansion high-temperature-resistant adhesive. The invention is used for preparing adhesives.

The invention relates to a heat-conducting polymer-base composite material and a preparation method thereof. The invention aims to solve the problems of high cost of the existing preparation method and poor heat conductivity of the obtained polymer-base composite material. The product is composed of a through-hole-bearing composite material plate, a filling material filled in the through hole of the through-hole-bearing composite material plate, film material layers positioned on the upper and lower surfaces of the through-hole-bearing composite material plate, and adhesive layers for bonding the film materials and the through-hole-bearing composite material plate. The method comprises the following steps: 1. preparing the through-hole-bearing composite material plate; 2. preparing a precuring plate; 3. preparing the composite plate; 4.preparing the cleaned composite plate; and 5. preparing the heat-conducting polymer-base composite material. The heat conductivity coefficient of the heat-conducting polymer-base composite material can reach 200-250 W / (m.K).

The invention provides a method for preparing a copper-based composite material. The preparation method includes the following steps: providing copper powder, zirconium tungstate powder and barium strontium titanate powder, and mixing the copper powder, zirconium tungstate powder and barium strontium titanate powder , to obtain the first mixed powder; utilize the method of dry ball milling to carry out ball milling to the first mixed powder, obtain the second mixed powder; carry out the first reduction heat treatment to the second mixed powder, obtain the third mixed powder; carry out the third mixed powder cold isostatic pressing to obtain the first block; hot pressing and sintering the first block to obtain the second block; and rolling the second block. The dry powder mixing process is used, thus improving the powder mixing efficiency and improving the powder mixing effect; the invention specially designs the reduction process, so that the oxidized powder in the powder mixing process can be accurately restored to the original state, and will not be reduced The oxide powder itself will not cause the oxygen content in the oxide to deviate from the ideal value, and the ordinary hot pressing sintering method is used, the technology is simple and mature, and the cost is low.

The invention discloses a method for preparing copper-antimony-doped tin-carbon-lithium ion anode materials, which includes the following steps: (1) tin dioxide doping modification: weighing a certain weight of tin dioxide, copper and antimony 100:(5-20):(5-20) ratio for dry ball milling and mixing for 0.5-1.5h; (2) Composite granulation of tin dioxide modified products and graphite; (3) Secondary coating modification . The present invention adopts copper and antimony to carry out doping modification to tin dioxide, reduces the expansion characteristic of tin-carbon composite, improves cycle performance; Short, simple process, easy to realize industrialized large-scale production; at the same time realize the advantages of granulation between tin dioxide and graphite, graphite and graphite, and can realize the function of surface modification of tin dioxide and graphite; adopt secondary packaging Coating can significantly improve the surface defects generated in the secondary granulation process, and improve the first-time efficiency and cycle performance of the product.

The invention belongs to the field of precision alloy, and particularly relates to a low-expansion magnetic shielding alloy for an optical fiber loop skeleton, and a preparation method thereof. The alloy comprises the following chemical components in percentage by weight: 32.0-35.2% of Ni, 3.0-3.5% of Co, 0.10-0.25% of Mn, less than or equal to 0.15% of Si, less than or equal to 0.02% of Cu, less than or equal to 0.01% of C, less than or equal to 0.01% of P, less than or equal to 0.01% of S, and the balance of Fe. The preparation method of the low-expansion magnetic shielding alloy comprises the following steps sequentially: preparation of high-purity raw materials, proportioning of ingredients, smelting of a vacuum induction furnace and vacuum arc remelting, forging and processing, sampling, thermal treatment, and performance test. The thermal treatment system comprises the steps of under protection of high-purity hydrogen gas, carrying out furnace heating to 970+ / -10DEG C, preserving heat for 2.5-3h, cooling to 550+ / -10DEG C at the speed of 200-250DEG C / h, rapidly cooling to 300DEG C below for discharging. Compared with the existing low-expansion alloy 4J32 and on the premise that low-expansion characteristic is kept, the low-expansion magnetic shielding alloy has high initial magnetic conductivity, integrates the two advantages of low expansion property and high magnetic shielding property, namely within the temperature range of -45DEG C to 75DEG C, the expansion coefficient of the alloy is 1.0*10<-6> / DEG C below; the initial magnetic conductivity is higher than 1.5mH / m.