Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

30results about How to "Low expansion properties" patented technology

Sapphire insulator metal shell and production process thereof

The invention relates to the technical field of electronic components and discloses a sapphire insulator metal shell. The sapphire insulator metal shell comprises a frame body and a cover plate; a bottom plate is fixedly installed at the bottom of the frame body; a carrier located in the frame body is fixedly installed at the top of the bottom plate; an annular frame is fixedly installed at the top of the frame body; a connecting ring is fixedly installed on the right side of the frame body; and a lead is fixedly installed in the connecting ring. According to the sapphire insulator metal shelland the production process thereof disclosed in the invention, through the material, the structure, the connection process and the like of a semiconductor integrated circuit packaging shell in the prior art, the purpose of improving the using performance of the semiconductor integrated circuit packaging shell is achieved, and the problems that when an existing semiconductor integrated circuit packaging shell is used, the connecting performance between packaging shell structures is common, the sealing welding process is not perfect, a selected insulating medium cannot bear ultrahigh withstoodvoltage, and the using performance is reduced are solved.
Owner:泰州联鑫电子科技有限公司

Preparation method of zirconium tungstate-containing aluminum-based composite material with high comprehensive performance

The invention discloses a preparation method of a zirconium tungstate-containing aluminum-based composite material with high comprehensive performance, and relates to a preparation method of a ZrW2O8 aluminum-based composite material. The problems that an existing ZrW2O8 / Al composite material is low in strength, and the thermal expansion coefficient of the composite material is large due to the fact that the content of gamma-ZrW2O8 is too high are solved. The method comprises the following steps: weighing ZrW2O8 powder, high-strength ceramic powder and an aluminum matrix as raw materials; the preparation method comprises the following steps: mixing high-strength ceramic powder and ZrW2O8 powder, carrying out ball milling, pre-pressing to obtain a reinforcement preform, preheating, preparing a molten metal matrix, carrying out liquid aluminum infiltration, and carrying out annealing treatment on the composite material. The volume fraction of a reinforcement is increased by adopting a mixing ratio of various particle sizes, internal stress is reduced through stress relief annealing treatment, so that the thermal expansion coefficient of the composite material is reduced, and the comprehensive performance of the composite material is improved.
Owner:HARBIN INST OF TECH

A kind of method for preparing tin-carbon lithium ion negative electrode material

The invention discloses a method for preparing a cathode material of tin-carbon lithium ion cathode material. The method comprises the following steps: (1) performing doping modification on tin dioxide, namely weighing certain amounts of nano tin dioxide and red copper oxide in a ratio of 100:(10-50), performing dry-method ball milling for 1 hour; and performing carbon heat reduction in an atmosphere furnace; (2) performing composite pelletizing on a tin dioxide modification product with graphite; (3) performing secondary wrapping modification. According to the method, as the tin dioxide is subjected to doping modification with the red copper oxide, the expansion property of a tin-carbon compound can be degraded, and the circulation property can be improved; due to two times of pelletization with processes of molding, roasting and dispersion formation, the method is short in time, simple in process and easy in industrial large-scale production; meanwhile, advantages of pelletization oftin dioxide and graphite and graphite and graphite can be achieved, and a function of surface modification upon the graphite with the tin dioxide can be also achieved; due to two times of coating, surface defects caused in the two times of pelletization process can be remarkably alleviated, and the first efficiency and the circulation property of a product can be improved.
Owner:FUJIAN XFH NEW ENERGY MATERIALS CO LTD

Method for preparing cathode material of tin-carbon lithium ion cathode material

The invention discloses a method for preparing a cathode material of tin-carbon lithium ion cathode material. The method comprises the following steps: (1) performing doping modification on tin dioxide, namely weighing certain amounts of nano tin dioxide and red copper oxide in a ratio of 100:(10-50), performing dry-method ball milling for 1 hour; and performing carbon heat reduction in an atmosphere furnace; (2) performing composite pelletizing on a tin dioxide modification product with graphite; (3) performing secondary wrapping modification. According to the method, as the tin dioxide is subjected to doping modification with the red copper oxide, the expansion property of a tin-carbon compound can be degraded, and the circulation property can be improved; due to two times of pelletization with processes of molding, roasting and dispersion formation, the method is short in time, simple in process and easy in industrial large-scale production; meanwhile, advantages of pelletization oftin dioxide and graphite and graphite and graphite can be achieved, and a function of surface modification upon the graphite with the tin dioxide can be also achieved; due to two times of coating, surface defects caused in the two times of pelletization process can be remarkably alleviated, and the first efficiency and the circulation property of a product can be improved.
Owner:FUJIAN XFH NEW ENERGY MATERIALS CO LTD

Method for preparing copper-antimony-doped tin-carbon-lithium ion cathode material

The invention discloses a method for preparing a copper-antimony-doped tin-carbon-lithium ion cathode material. The method comprises the following steps: (1) carrying out doping modification on tin dioxide, namely weighing certain amounts of tin dioxide, copper and antimony, and carrying out dry-method ball-milling mixing for 0.5-1.5 hours in a ratio of 100:(5-20):(5-20); (2) carrying out composite pelletizing on a tin dioxide modified product and graphite; (3) carrying out secondary coating modification. By adopting the method, copper and antimony are adopted to carry out doping modificationon the tin dioxide, so that the expansion properties of a tin-carbon compound can be degraded, and circulation properties can be improved; secondary pelletizing is carried out through isostatic compaction, roasting and dispersion shaping processes, and the method is short in time, simple in process and easy in industrial large-scale production; meanwhile, the advantage of pelletizing of tin dioxide and graphite and graphite and graphite can be taken into play, and a function that surface modification of the graphite with the tin dioxide can be also achieved; due to two times of coating, surface defects caused in a secondary pelletizing process can be remarkably alleviated, and the first-time frequency and the circulation properties of a product can be improved.
Owner:SHENZHEN XIANGFENGHUA TECH CO LTD +1

Expansive soil improver, improved expansive soil and preparation method

The invention provides an expansive soil improver. The expansive soil improver comprises 5-15% of biochar based on the total weight of dry expansive soil to be improved by the expansive soil improver, and the biochar is any one of wood chip biochar or pig manure biochar. The invention also provides a preparation method of the expansive soil improver. The method comprises the following steps of: pyrolyzing the biochar for two hours at the temperature of 400 DEG C under an anoxic condition; hammering the pyrolyzed biochar; sieving the pyrolyzed biochar by a 2mm sieve; and placing the biochar in a drying oven at the temperature of 105 DEG C for more than 15 hours. The invention also provides improved expansive soil and a preparation method thereof. The improved expansive soil is prepared by mixing the following raw materials in parts by weight: 100 parts of dry expansive soil to be improved; 5-15 parts of expansive soil improver; and a plurality of parts of deionized water. The expansive soil improver disclosed by the invention has the advantages of easily available materials, low cost, environmental friendliness, easiness in mixing and the like; and the improved expansive soil obtained according to the expansive soil improver is good in mechanical and engineering performance, and the expansion and shrinkage rate is inhibited.
Owner:GUANGXI UNIV

Flip-chip substrate, manufacturing method thereof, and LED packaging structure based on the flip-chip substrate

The invention provides a flip-chip substrate which comprises a copper heat sink plate. An insulating tape is embedded in the copper heat sink plate, and the copper heat sink plate is divided into two electrodes by the insulating tape; and tungsten-copper alloy bosses for fixing LED (Light Emitting Diode) chip are respectively welded on the two electrodes, and electroplating layers are arranged on the surfaces of the tungsten-copper alloy bosses. The flip-chip substrate is simple in structure, the manufacturing process flow of the substrate is simplified, and the production cost is greatly lowered; the installation height of the LED chips in a lamp can be enhanced by the tungsten-copper alloy bosses, so that more light emitted from the LED chips can be perpendicularly incident on the working surface of a packaged lens, and the problem that an adhesive for the lens of the conventional ceramic substrate influences a light out-coupling efficiency is solved; and furthermore, the positive and negative poles of the LED chips are directly and conductively connected with the tungsten-copper alloy bosses, a gold wiring process of the conventional process is avoided, and thus the packaging process flow of the LED chips can be further simplified.
Owner:ELEC TECH OPTOELECTRONICS TECHWUHUCO

Copper matrix composite material and preparation method thereof

The invention provides a method for preparing a copper-based composite material. The preparation method includes the following steps: providing copper powder, zirconium tungstate powder and barium strontium titanate powder, and mixing the copper powder, zirconium tungstate powder and barium strontium titanate powder , to obtain the first mixed powder; utilize the method of dry ball milling to carry out ball milling to the first mixed powder, obtain the second mixed powder; carry out the first reduction heat treatment to the second mixed powder, obtain the third mixed powder; carry out the third mixed powder cold isostatic pressing to obtain the first block; hot pressing and sintering the first block to obtain the second block; and rolling the second block. The dry powder mixing process is used, thus improving the powder mixing efficiency and improving the powder mixing effect; the invention specially designs the reduction process, so that the oxidized powder in the powder mixing process can be accurately restored to the original state, and will not be reduced The oxide powder itself will not cause the oxygen content in the oxide to deviate from the ideal value, and the ordinary hot pressing sintering method is used, the technology is simple and mature, and the cost is low.
Owner:国工恒昌新材料(义乌)有限公司

A low-expansion magnetic shielding alloy and its preparation method

The invention belongs to the field of precision alloy, and particularly relates to a low-expansion magnetic shielding alloy for an optical fiber loop skeleton, and a preparation method thereof. The alloy comprises the following chemical components in percentage by weight: 32.0-35.2% of Ni, 3.0-3.5% of Co, 0.10-0.25% of Mn, less than or equal to 0.15% of Si, less than or equal to 0.02% of Cu, less than or equal to 0.01% of C, less than or equal to 0.01% of P, less than or equal to 0.01% of S, and the balance of Fe. The preparation method of the low-expansion magnetic shielding alloy comprises the following steps sequentially: preparation of high-purity raw materials, proportioning of ingredients, smelting of a vacuum induction furnace and vacuum arc remelting, forging and processing, sampling, thermal treatment, and performance test. The thermal treatment system comprises the steps of under protection of high-purity hydrogen gas, carrying out furnace heating to 970+ / -10DEG C, preserving heat for 2.5-3h, cooling to 550+ / -10DEG C at the speed of 200-250DEG C / h, rapidly cooling to 300DEG C below for discharging. Compared with the existing low-expansion alloy 4J32 and on the premise that low-expansion characteristic is kept, the low-expansion magnetic shielding alloy has high initial magnetic conductivity, integrates the two advantages of low expansion property and high magnetic shielding property, namely within the temperature range of -45DEG C to 75DEG C, the expansion coefficient of the alloy is 1.0*10<-6> / DEG C below; the initial magnetic conductivity is higher than 1.5mH / m.
Owner:CENT IRON & STEEL RES INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products