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Heat-conducting polymer-base composite material and preparation method thereof

A technology of composite materials and composite material plates, which is applied in the field of thermally conductive polymer-based composite materials and its preparation, and can solve the problems of poor thermal conductivity and high cost of polymer-based composite materials

Inactive Publication Date: 2015-04-29
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention aims to solve the problems of high cost of the existing preparation method and the poor thermal conductivity of the obtained polymer matrix composite material, and provides a thermally conductive polymer matrix composite material and its preparation method

Method used

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  • Heat-conducting polymer-base composite material and preparation method thereof
  • Heat-conducting polymer-base composite material and preparation method thereof
  • Heat-conducting polymer-base composite material and preparation method thereof

Examples

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specific Embodiment approach 1

[0083] Embodiment 1: A thermally conductive polymer-based composite material in this embodiment consists of a composite material plate 1 with through holes, a filling material 2 filled in the through holes of the composite material plate 1 with through holes, and a Composed of a membrane material layer 3 on the composite material plate and lower surface of the hole;

[0084] The material of the composite material plate 1 with through holes is a polymer-based composite material;

[0085] The shape of the filling material 2 is cylindrical or quasi-cylindrical, the filling material 2 is a material with a thermal conductivity of 200W / (m·K)~1000W / (m·K), and the filling material 2 The thickness is greater than the thickness of the composite material plate 1 with through holes;

[0086] The material of the film material layer 3 is aluminum foil, copper foil or graphite film;

[0087] The volume ratio of the composite material plate 1 with through holes to the thermally conductive p...

specific Embodiment approach 2

[0090] Embodiment 2: This embodiment is different from Embodiment 1 in that: the filling material 2 is copper, aluminum or carbon fiber. Other steps and parameters are the same as those in the first embodiment.

specific Embodiment approach 3

[0091] Embodiment 3: This embodiment is different from Embodiment 1 or Embodiment 2 in that: the diameter of the filling material 2 is 0.2mm-5mm. Other steps and parameters are the same as those in Embodiment 1 or 2.

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Abstract

The invention relates to a heat-conducting polymer-base composite material and a preparation method thereof. The invention aims to solve the problems of high cost of the existing preparation method and poor heat conductivity of the obtained polymer-base composite material. The product is composed of a through-hole-bearing composite material plate, a filling material filled in the through hole of the through-hole-bearing composite material plate, film material layers positioned on the upper and lower surfaces of the through-hole-bearing composite material plate, and adhesive layers for bonding the film materials and the through-hole-bearing composite material plate. The method comprises the following steps: 1. preparing the through-hole-bearing composite material plate; 2. preparing a precuring plate; 3. preparing the composite plate; 4.preparing the cleaned composite plate; and 5. preparing the heat-conducting polymer-base composite material. The heat conductivity coefficient of the heat-conducting polymer-base composite material can reach 200-250 W / (m.K).

Description

technical field [0001] The invention relates to a thermally conductive polymer-based composite material and a preparation method thereof. Background technique [0002] As we all know, carbon fiber reinforced resin matrix composites have been widely used in aerospace and other fields due to their advantages of high strength, high modulus and low cost, among which T300, T700 and M40J are the most common carbon fiber types. The test shows that the in-plane thermal conductivity of the quasi-isotropic T700 / epoxy composite is only 3.6W / (m·K). This greatly limits its use in high-end heat dissipation fields such as notebook computers and satellite structures. In these high-end heat dissipation fields, it is expected that the thermal conductivity of carbon fiber composite materials can reach the level of aluminum alloy, that is, the thermal conductivity can reach 120W / (m·K). [0003] In order to solve this problem, United Carbide successfully synthesized mesophase pitch-based carbo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B5/22B32B7/12B32B15/04B32B15/20B32B27/06B32B37/06B32B37/10
CPCB32B5/22B32B7/12B32B15/04B32B15/20B32B27/06B32B37/06B32B37/10
Inventor 吴林志于国财
Owner HARBIN INST OF TECH
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