Sapphire insulator metal shell and production process thereof

A metal shell and sapphire technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of general connection performance of the packaging shell structure, the inability of the insulating medium to withstand ultra-high withstand voltage, and the imperfect sealing and welding process, etc.

Inactive Publication Date: 2020-02-07
泰州联鑫电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a sapphire insulator metal shell and its production process, which has the advantages of improving the performance of the semiconductor integrated circuit packaging shell, and solves the problem of the packaging she

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  • Sapphire insulator metal shell and production process thereof
  • Sapphire insulator metal shell and production process thereof
  • Sapphire insulator metal shell and production process thereof

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Embodiment Construction

[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] see Figure 1-3 , a sapphire insulator metal shell, including a frame 1 and a cover plate 3, the bottom of the frame 1 is fixed with a bottom plate 2, the frame 1 is made of zirconia ceramics, and the inside of the bottom plate 2 is provided with a 1 The circular groove on the left side, the top of the bottom plate 2 is fixedly installed with the carrier 5 inside the frame body 1, the bottom plate 2 is made of tungsten copper, the top of the bottom plate 2 is provided w...

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Abstract

The invention relates to the technical field of electronic components and discloses a sapphire insulator metal shell. The sapphire insulator metal shell comprises a frame body and a cover plate; a bottom plate is fixedly installed at the bottom of the frame body; a carrier located in the frame body is fixedly installed at the top of the bottom plate; an annular frame is fixedly installed at the top of the frame body; a connecting ring is fixedly installed on the right side of the frame body; and a lead is fixedly installed in the connecting ring. According to the sapphire insulator metal shelland the production process thereof disclosed in the invention, through the material, the structure, the connection process and the like of a semiconductor integrated circuit packaging shell in the prior art, the purpose of improving the using performance of the semiconductor integrated circuit packaging shell is achieved, and the problems that when an existing semiconductor integrated circuit packaging shell is used, the connecting performance between packaging shell structures is common, the sealing welding process is not perfect, a selected insulating medium cannot bear ultrahigh withstoodvoltage, and the using performance is reduced are solved.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a metal shell of a sapphire insulator and a production process thereof. Background technique [0002] With the continuous advancement of thinning and miniaturization of electronic components, semiconductor integrated circuits require packaging with better electrical performance, higher power density, higher reliability, and lighter weight. Therefore, high thermal conductivity materials such as tungsten copper / molybdenum copper are more and more widely used in the packaging field, ceramics / sapphire and other materials are gradually replacing glass, and plastics have become a trend. [0003] At present, when the semiconductor integrated circuit packaging shell is in use, the connection performance between the packaging shell structures is average, because the sealing and welding process is not perfect, the selected insulating medium cannot withstand ultra-high withsta...

Claims

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Application Information

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IPC IPC(8): H01L23/045H01L23/06H01L23/10H01L21/48
CPCH01L21/4807H01L21/4817H01L23/045H01L23/06H01L23/10
Inventor 钱华国陈鹏
Owner 泰州联鑫电子科技有限公司
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