Package substrate and its manufacturing method and LED package structure based on the package substrate

Abstract

The invention provides a package substrate which comprises a copper heat sink plate. Two insulating belts are inlaid on the copper heat sink plate, and the copper heat sink plate is divided into three areas, respectively an electrode area, a welding belt area and an electrode area by the two insulating belts. Tungsten-copper alloy bosses used for fixing light-emitting diode (LED) chips are welded on the welding belt area, and electroplated layers are respectively arranged on the tungsten-copper alloy bosses and the surfaces of the two electrodes. The package substrate is simple in structure, capable of simplifying manufacturing process of the package substrate and greatly reducing manufacturing cost of an LED package substrate. Installation height of the LED chip in a lamp is increased by the tungsten-copper alloy bosses, and therefore light emitted by the LED chips can directly light on working faces of package lenses. The problem that a light extracting rate can be influenced by bonding glue of lenses of a traditional ceramic substrate is solved, and a light emitting rate of an LED bead is increased.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a packaging substrate, a manufacturing method thereof, and an LED packaging structure based on the packaging substrate. Background technique [0002] LED (Light Emitting Diode) is a solid-state semiconductor device that converts electrical energy into light energy. With the advantages of low power consumption, good light concentrating effect, fast response, strong controllability, high impact resistance, long service life, and environmental protection, LED is gradually replacing traditional light sources and becoming the fourth-generation light source. [0003] Although LED is energy-saving, but like ordinary incandescent lighting, part of the energy is converted into light, and another part of the energy is converted into heat, especially LED is a point-shaped light source, and the heat generated by it is also concentrated in a very small area. The heat generated cannot b...

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Problems solved by technology

[0003] Although LED is energy-saving, but like ordinary incandescent lighting, part of the energy is converted into light, and another part of the energy is converted into heat, especially LED is a point-shaped light source, and the heat generated by it is also concentrated in a very small area. The heat generated cannot be dissipated in time, and the junction temperature of the PN junction will rise, which will accelerate the aging of the chip and packaging materials, and may also cause the solder joints to melt, causing the chip to fail, which will directly affect the service life and luminous performance of the LED, especially High-power LEDs generate more heat and require higher heat dissipation technology

[0004] Ceramic substrates have the advantages of high heat dissipation, low thermal resistance, long life, wide operating temperature, and withstand voltage. However, the preparation of ceramic heat dissipation substrates requires high equipment and technology, and the manufacturing process is quite complicated. , evaporation, sputtering, electroplating, and electroless plating make the ceramic substrate expensive

In addition, in the traditional ceramic substrate, the bonding glue of the packaging lens and the copper-metal composite layer will have a certain impact on the light output of the LED chip. This part of the glue blocks a part of the light emitted from the side of the LED chip, making the use of LED side light rate drop

For this problem, technical personnel in the industry have also proposed improvements, such as the Chinese patent No. 201220168404.8, which discloses a substrate structure for LED chip packaging, although this solution solves the problem of using traditional ceramic substrates to reduce the lateral light output rate of LED chips. problem, but the design of the circuit layer and the micron-scale ultra-thin ceramic insulating layer increases the complexity of the process. In addition, the patent uses a tungsten-copper alloy panel with bosses, which increases the cost of materials, making this packaging substrate The costly problem remains unresolved

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