48results about How to "Improve drilling processability" patented technology

The invention relates to the technical field of machining of a motor component, in particular to a drilling device for a motor casing. The drilling device comprises a base, an electric telescopic rod,a drill bit, a clamping mechanism, a rotating column, a rotating shaft and an anti-loosening mechanism, wherein the electric telescopic rod is fixedly arranged on the top of the left side of the base; a drilling motor for driving the drill bit to rotate is fixedly arranged on the lower surface of the middle part of a supporting carrier plate; the rotating column is rotatably arranged at the middle of a carrier plate of the base in a penetration manner; and the clamping mechanism for clamping and fixing the motor casing is fixedly arranged on the top end of the rotating column. The drilling device has the advantages of simple operation, stable structure, convenience for clamping and fixing of the motor casing, a good drilling machining effect and flexibility in use.

The present invention provides an improved epoxy resin composition enabling better dimensional stability of a laminate by decreasing the coefficient of thermal expansion in its thickness direction of a laminate manufactured using an epoxy resin composition as a material, and by retaining a high level of adhesion in the cured product thereof, enabling better drilling workability of the laminate and suppression of crack development therein during the drilling process, and enabling to decrease impregnation of the plating solution into the laminate associated with those cracks.

This epoxy resin composition includes:

• • (A) an epoxy resin;
  • (B) a curing agent composed of phenolic novolac resin curing agent or amine curing agent,
  • (C) an inorganic filler composed of aluminum hydroxide with or without spherical silica; and
  • (D) an elastic component made of minute particles having a core-shell structure with its shell constituted by a resin which is compatible with said epoxy resin (A).

The epoxy resin composition exhibits, when cured into an article, a linear coefficient (a_z) of thermal expansion of 48 or less with respect to a thickness of said article.

The invention relates to a prepreg for improving electric leakage-resisting tracking index and drilling processing properties and an application thereof. The prepreg is prepared according to the method which comprises the following steps: controlling a coating linear velocity at 6-15m/min, circularly loading an adhesive onto a gluing machine, uniformly coating a glass fiber cloth with the adhesive by presoaking and primarily soaking, baking the glass fiber cloth coated with the adhesive in a drying box at 100 DEG C-250 DEG C, evaporating the solvent, preliminarily reacting and curing the adhesive, thereby acquiring the prepreg. Compared with the prior art, the invention not only can promote the electric leakage-resisting tracking index of a Tg unleaded coated copper foil plate, but also can obviously improve the drilling processing properties of a sandwich plate prepared from the prepreg.

The invention provides a thermosetting resin composition, a prepreg containing the same, a metal foil-coated laminate, and a printed circuit board. The thermosetting resin composition comprises alicyclic epoxy resin with a structure as shown in a formula I. Through usage of the alicyclic epoxy resin with a specific structure, the prepared resin composition has excellent resistance to yellowing caused by heat, resistance to ageing caused by light and excellent drilling processability; and a laminate, the metal foil-coated laminate and the printed circuit board prepared from the composition have excellent heat resistance, excellent resistance to ageing caused by light and a water absorption rate of 0.32% or below. According to the invention, the problems of proneness to yellowing and ageing under heat and proneness to yellowing and ageing under illumination of traditional printed circuit boards are overcome; and a preparation process for the thermosetting resin composition is simple and feasible and is low in cost.

The invention provides a resin composition, a prepreg containing the resin composition, a dielectric substrate and a printed circuit board. The resin composition comprises the following components: (A) thermosetting resin with unsaturated double bonds; (B) a resin film-forming property improving material; (C) Hexagonal boron nitride; D, any one or a combination of at least two of aluminum nitride,silicon nitride or silicon carbide; (E) other inorganic fillers except the components (C) and (D); (F) a flame retardant and (G) an initiator, wherein the mass sum of the component (C), the component(D) and the component (E) accounts for 60-80% of the total mass of the resin composition, and the mass ratio of the component (C) to the component (D) is (1-4): 2. The dielectric substrate obtained by using the resin composition provided by the invention has the advantages of low dielectric constant, low dielectric loss, high thermal conductivity and stable thickness and dielectric constant, andcan fully meet the requirements of a high-frequency high-thermal-conductivity dielectric substrate.

An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).

The present invention relates to a thermosetting resin composition. The composition comprises from about 20 wt. % to about 70 wt. % of a thermosetting resin, from about 1 wt. % to about 30 wt. % of a curing agent, from about 0 wt. % to about 10 wt. % of an accelerant, a tungsten compound, and an inorganic filler. A prepreg may be prepared in an impregnation manner or a coating product may be prepared in a coating manner. The composition may decrease the thermal expansion coefficient of laminates and may effectively block UV light and decrease the light transmissivity.

A resin composition is provided. The resin composition includes the following constituents:

• • (A) an epoxy resin;
  • (B) an amino group-containing hardener; and
  • (C) a compound of formula (I),

wherein, R¹¹ to R¹⁶ and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).

A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m²/g to 15 m²/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.

The invention discloses a thermosetting epoxy resin composition, which contains modified silicon dioxide and therefore can be used in the preparation of epoxy resin laminated boards with a low expansion coefficient property and excellent drilling processability. The modified silicon dioxide does not contain crystal water, has a low expansion coefficient property and comprises 40 to 80 weight percent of silicon dioxide and 60 to 20 percent of inorganic additive. And the modified silicon dioxide is prepared by sintering and melting at a high temperature above 1,000 DEG C and crushing.

The invention discloses a drilling machining device for a metal plate. The drilling machining device comprises a base, a supporting shaft, a driving mechanism, a machining table, multiple supporting units, N first racks and (n+1) drilling mechanisms, and N is a positive integer; the supporting shaft is vertically and rotationally installed on the base; the driving mechanism is used for driving thesupporting shaft to rotate; the machining table is installed on the supporting shaft; the multiple supporting units are sequentially distributed around the circumferential direction of the supportingshaft, and the supporting units comprise supporting plates and first gears, and the supporting plates are rotationally connected with the machining table; the first gears are installed on the supporting plates; and the N first racks are uniformly distributed in the circumferential direction of the supporting shaft, and the first racks are located on the moving path of the first gears. The drilling machining device has the advantages of being high in drilling efficiency and good in effect.

A thermosetting resin composition and a prepreg and a metal foil-covered laminate made using same, the thermosetting resin composition comprising component (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a poly-functional vinyl aromatic copolymer having a stoctoal unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and component (B): a vinyl-containing organic silicone resin. The prepreg and metal foil-covered laminate made from the thermosetting resin composition have good toughness, and maintain a high glass transition temperature, a low water absorption, dielectric properties and humidity resistance, being suitable for the field of high-frequency and high-speed printed circuit boards and the processing of multilayer printed circuit boards.