Prepreg for improving electric leakage-resisting tracking index and drilling processing properties and application thereof

A technology of anti-tracking and prepreg, which is applied in applications, other household appliances, electronic equipment, etc., can solve the problems of insufficient toughness and easy microcracks of printed circuit boards, and achieve excellent anti-tracking characteristics, good drilling Improvement of hole processing performance and heat resistance

Inactive Publication Date: 2017-10-27
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the toughness of the printed circuit board prepared by using this material is insufficient, and microcracks are prone to appear especially in the process of processing dense holes, which is the technical problem that this application needs to solve

Method used

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  • Prepreg for improving electric leakage-resisting tracking index and drilling processing properties and application thereof
  • Prepreg for improving electric leakage-resisting tracking index and drilling processing properties and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3

[0034] An adhesive suitable for improving the drilling performance of medium Tg lead-free printed circuit boards. Oxygen resin, phenolic resin curing agent, imidazole accelerator, amine curing agent, silane, inorganic filler, barium sulfate, organic solvent and toughening agent, etc., as shown in Table 1.

[0035] Table 1

[0036] material name

Example 1

Example 2

Example 3

Comparative example 1

Comparative example 2

Comparative example 3

Novolac epoxy resin

12

10

11

12

10

13

Isocyanate Modified Epoxy Resin

10

10

9

10

10

8

High Brominated Epoxy Resin

5

4

4

5

4

6

Bisphenol A Brominated Epoxy Resin

26

29

30

26

29

25

Phenolic resin curing agent

18

17

17

18

17

18

imidazole accelerator

0.02

0.02

0.02

0.02

0.02

0.02

Amine curing agent

0.18

0.17

0.17 ...

Embodiment 4

[0061] Prepregs with improved tracking resistance index and drilling processing performance, control the glue line speed to 6m / min, circulate the adhesive to the glue machine, and apply the adhesive evenly on the glass after pre-dipping and main dipping On the fiber cloth; the glass fiber cloth coated with the adhesive is baked in a 100°C oven to volatilize the solvent, and the adhesive is initially reacted and solidified to obtain a prepreg.

[0062] Control of the physical parameters of the prepreg: gelation time: 250 seconds; resin content: 40% (referring to the mass percentage of the resin component in the prepreg); resin fluidity: 20%; volatile matter: 0.29%.

[0063] Adhesives are prepared by the following methods:

[0064] (1) Prepare materials according to the raw materials of the following components and parts by weight:

[0065] Novolac epoxy resin 5, isocyanate modified epoxy resin 5, high brominated epoxy resin 2, bisphenol A type brominated epoxy resin 5, phenoli...

Embodiment 5

[0071] Prepregs with improved tracking resistance index and drilling processing performance, control the glue line speed to 10m / min, circulate the adhesive to the glue machine, and apply the adhesive evenly on the glass after pre-dipping and main dipping On the fiber cloth; the glass fiber cloth coated with the adhesive is baked in a 200°C oven to volatilize the solvent, and the adhesive is initially reacted and solidified to obtain a prepreg.

[0072] Control of the physical parameters of the prepreg: gelation time: 300 seconds; resin content: 60% (referring to the mass percentage of the resin component in the prepreg); resin fluidity: 30%; volatile matter: 0.35%.

[0073] Adhesives are prepared by the following methods:

[0074] (1) Prepare materials according to the raw materials of the following components and parts by weight:

[0075] Novolak type epoxy resin 20, isocyanate modified epoxy resin 20, high bromine epoxy resin 15, bisphenol A type brominated epoxy resin 25, ...

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Abstract

The invention relates to a prepreg for improving electric leakage-resisting tracking index and drilling processing properties and an application thereof. The prepreg is prepared according to the method which comprises the following steps: controlling a coating linear velocity at 6-15m/min, circularly loading an adhesive onto a gluing machine, uniformly coating a glass fiber cloth with the adhesive by presoaking and primarily soaking, baking the glass fiber cloth coated with the adhesive in a drying box at 100 DEG C-250 DEG C, evaporating the solvent, preliminarily reacting and curing the adhesive, thereby acquiring the prepreg. Compared with the prior art, the invention not only can promote the electric leakage-resisting tracking index of a Tg unleaded coated copper foil plate, but also can obviously improve the drilling processing properties of a sandwich plate prepared from the prepreg.

Description

technical field [0001] The invention relates to the field of copper-clad sheet production, in particular to a prepreg for improving tracking resistance index and drilling processing performance and its application. Background technique [0002] With the development of electronic and electrical products in the direction of lightness, thinness, smallness, multi-functionality and high performance, more and thinner layers of PCB are required, and the structure is more diversified, such as the hole spacing is getting smaller and smaller, and the density of space is getting more and more dense. High, multi-layer boards prepared by traditional prepregs have gradually exposed many processing problems, mainly in the following aspects: the dense holes of some structural multi-layer boards are prone to delamination explosion after thermal shock, micro-cracks on the substrate, Resin shrinkage and other undesirable phenomena, so it is necessary to optimize and improve the traditional for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/04C08L51/04C08K13/04C08K7/00C08K7/14C08K3/30B32B17/02B32B15/14B32B37/06B32B37/10B32B17/12
CPCB32B15/14B32B17/067B32B37/06B32B37/10B32B2255/02B32B2255/26B32B2262/101B32B2307/202B32B2307/306B32B2457/08C08K2003/3045C08K2201/003C08L63/00C08L63/04C08L2201/02C08L2205/02C08L2205/025C08L2205/035C08L2207/53C08L51/04C08K13/04C08K7/00C08K7/14C08K3/30
Inventor 密亚男粟俊华席奎东
Owner NANYA NEW MATERIAL TECH CO LTD
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