Thermosetting resin composition, prepreg containing same, metal foil-coated laminate and printed circuit board

A resin composition and thermosetting technology, applied in the field of laminate materials, can solve the problems of low viscosity stability, poor preservation, heat resistance, light aging resistance, and the improvement of water absorption and other properties is not obvious, and achieves low water absorption, Low cost and excellent drilling workability

Active Publication Date: 2017-07-04
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the use of epoxy resin with this structure, the problems of low viscosity stability and poor preservation have been successfully solved, but the improvement of heat resistance, light aging resistance and water absorption is not obvious

Method used

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  • Thermosetting resin composition, prepreg containing same, metal foil-coated laminate and printed circuit board
  • Thermosetting resin composition, prepreg containing same, metal foil-coated laminate and printed circuit board
  • Thermosetting resin composition, prepreg containing same, metal foil-coated laminate and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] In the present embodiment, the cycloaliphatic epoxy resin used has the structure shown in the following formula (I)-1:

[0044]

[0045] Use 29.95 parts of bisphenol A type cyanate ester, 35 parts of alicyclic epoxy resin (I)-1, 0.05 part of 2-methylimidazole, 15 parts of SPB100 (phosphazene flame retardant, Japan Otsuka), 20 parts Titanium dioxide, using appropriate amount of methyl ethyl ketone and toluene to dissolve the above compounds, and prepare a glue with a suitable viscosity. Use this glue solution to impregnate 1078 electronic grade glass cloth, and remove the solvent in an oven at 115°C to obtain a B-stage prepreg sample with a resin content of 54%.

[0046] Two sheets of prepreg prepared above and two sheets of one ounce electrolytic copper foil were stacked together, and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: 1. When the temperature of the material is 80°C to 120°C, the heating ...

Embodiment 2

[0048] In the present embodiment, the cycloaliphatic epoxy resin used has structure shown in following formula (1)-2:

[0049]

[0050] Use 24.95 parts of EPIKOTE828EL bisphenol A epoxy resin (Dow Chemical), 40 parts of alicyclic epoxy resin (I)-2, 0.05 parts of 2-methylimidazole, 15 parts of SPB100 (Japan Otsuka), 20 parts of titanium dioxide , using proper amount of methyl ethyl ketone and toluene to dissolve the above compound, and prepare a glue solution with suitable viscosity. Use this glue solution to impregnate 1078 electronic grade glass cloth, and remove the solvent in an oven at 115°C to obtain a B-stage prepreg sample with a resin content of 54%.

[0051] Two sheets of prepreg prepared above and two sheets of one ounce electrolytic copper foil were stacked together, and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: 1. When the temperature of the material is 80°C to 120°C, the heating rate is co...

Embodiment 3

[0053] In the present embodiment, use the alicyclic epoxy resin of the structure shown in the formula (I)-1 identical with embodiment 1, and difference only is that the consumption of bisphenol A type cyanate is 58.95 parts, and formula (I) The consumption of the cycloaliphatic epoxy resin with the structure shown in -1 is 6 parts, and the rest of the ingredients and the dosage of the ingredients are the same as those in Example 1. They are produced and tested according to the method of Example 1, and the corresponding properties are shown in Table 1.

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Abstract

The invention provides a thermosetting resin composition, a prepreg containing the same, a metal foil-coated laminate, and a printed circuit board. The thermosetting resin composition comprises alicyclic epoxy resin with a structure as shown in a formula I. Through usage of the alicyclic epoxy resin with a specific structure, the prepared resin composition has excellent resistance to yellowing caused by heat, resistance to ageing caused by light and excellent drilling processability; and a laminate, the metal foil-coated laminate and the printed circuit board prepared from the composition have excellent heat resistance, excellent resistance to ageing caused by light and a water absorption rate of 0.32% or below. According to the invention, the problems of proneness to yellowing and ageing under heat and proneness to yellowing and ageing under illumination of traditional printed circuit boards are overcome; and a preparation process for the thermosetting resin composition is simple and feasible and is low in cost.

Description

technical field [0001] The invention belongs to the field of laminate materials, and relates to a thermosetting resin composition, a prepreg containing it, a metal foil-clad laminate and a printed circuit board. Background technique [0002] In recent years, the structure of LEDs has also changed, from a structure with pins to a chip structure (Chip-LED), making surface mount LEDs a reality and further promoting the miniaturization of electronic products. Surface-mounted LEDs are made by mounting the light-emitting elements directly on the electrodes of the PCB and encapsulating them with resin. Its basic structure is as follows: figure 1 As shown, in the process of processing and using the PCB substrate installed with LEDs, under the condition of heat treatment and long-term light, due to aging and discoloration, the light reflectivity will drop significantly, which will affect the working quality and service life of electronic products. For chip LEDs, traditional FR-4 cop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/24C08G59/32C08G59/50C08K3/22C09J163/00C08J5/24B32B27/38B32B15/20B32B15/092H05K1/02
CPCB32B15/092B32B15/20B32B27/38C08G59/24C08G59/32C08G59/50C08J5/24C08K3/22C08L63/00C08L2201/08C08L2203/20C09J163/00H05K1/02
Inventor 黄增彪成浩冠雷爱华
Owner GUANGDONG SHENGYI SCI TECH
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