Resin composition and application thereof

A resin composition and resin technology, applied in the field of laminates, can solve the problems of high tensile strength and peel strength, can not meet the application of thin lines, cannot be obtained, etc., achieve good peel strength, avoid pressure resistance and reliable thin lines Sexual effect, sharp particle size distribution effect

Active Publication Date: 2021-11-05
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] D100 is not limited in the above prior art, and there is a defect in the existence of large particle size silica, which cannot obtain high tensile strength and peel strength, and cannot meet the application of thin lines. Therefore, in the present invention, it is expected to develop a A resin composition that can make adhesive films and resin-coated copper foils have high relative tensile strength and peel strength, good drilling processability, controllable fluidity, good glue filling ability and higher electrical strength

Method used

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  • Resin composition and application thereof
  • Resin composition and application thereof
  • Resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] First dissolve 28 parts of epoxy resin (NC-3000H) and 21 parts of phenolic resin (SN-485) with an appropriate amount of solvent, and stir for more than 2 hours.

[0055] Then add 61% of silicon dioxide 3 (D50 is 0.5 μm, D100:D10 is 2.0, and the purity is 99.90%) obtained by organosilicon hydrolysis, and continue to stir for more than 4 hours, and mix well to form a solid content of 70%. solution.

[0056] The above solution was coated on the release film, and after drying, it was put into an oven at 100°C and baked for 5 minutes to obtain an adhesive film of a semi-cured resin layer. Press and cure the semi-cured adhesive film (thickness 40 μm) and the browned PCB board, tear off the release film and then perform surface treatment, copper electroplating, to form a laminated printed circuit board with lines.

Embodiment 2

[0058] Except changing the ratio of silicon dioxide synthesized by the chemical method used in Example 1, the same method as in Example 1 was used to manufacture the adhesive film.

[0059] First dissolve 28 parts of epoxy resin (NC-3000H) and 21 parts of phenolic resin (SN-485) with an appropriate amount of solvent, and stir for more than 2 hours.

[0060] Then add 73% of silicon dioxide 3 (D50 is 0.5 μm, D100:D10 is 2.0, and the purity is 99.90%) obtained by organosilicon hydrolysis, and continue to stir for more than 4 hours, and mix well to form a solid content of 70%. solution.

[0061] Coat the above solution on the release film, dry it, and bake it in an oven at 100°C for 3 minutes to obtain a semi-cured resin layer film. Press and cure the semi-cured adhesive film (thickness 40 μm) and the browned PCB board, tear off the release film and then perform surface treatment, copper electroplating, to form a laminated printed circuit board with lines.

Embodiment 3

[0063] Except changing the ratio of the chemically synthesized silicon dioxide used in Example 1, the same method as in Example 1 was used to manufacture the adhesive film.

[0064] First dissolve 28 parts of epoxy resin (NC-3000H) and 21 parts of phenolic resin (SN-485) with an appropriate amount of solvent, and stir for more than 2 hours.

[0065] Then add 85% silicon dioxide 3 (D50 is 0.5 μm, D100:D10 is 2.0, and the purity is 99.90%) obtained by organosilicon hydrolysis, and continue to stir for more than 4 hours, and mix well to form a solid content of 70%. solution.

[0066] Coat the above solution on the release film, dry it, and bake it in an oven at 100°C for 3 minutes to obtain a semi-cured resin layer film. Press and cure the semi-cured adhesive film (thickness 40 μm) and the browned PCB board, tear off the release film and then perform surface treatment, copper electroplating, to form a laminated printed circuit board with lines.

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Abstract

The invention provides a resin composition and an application thereof. The resin composition comprises the following components in percentage by weight: 15-39% of crosslinkable and curable resin and 61-85% of filler; and the filler is silicon dioxide prepared by an organic silicon hydrolysis method, the average particle size D50 of the silicon dioxide is 0.1-3 microns, the ratio of D100 to D10 is less than or equal to 2.5, and the purity of the silicon dioxide is greater than 99.9%. According to the resin composition disclosed by the invention, a prepared adhesive film and a resin-coated copper foil have relatively high tensile strength and peel strength, relatively good drilling processability, controllable flowability, good adhesive filling capability and relatively high electrical strength, can realize finer circuit processing capability, and are a printed circuit board material capable of being applied to a multi-layer laminated board, particularly a printed circuit board material of a multilayer laminated board with fine lines.

Description

technical field [0001] The invention belongs to the technical field of laminated boards, and relates to a resin composition and its application. Background technique [0002] With the mass production of electronic information products and the design trend towards light, thin, small, and multi-functional, the printed circuit substrate, which is the main support of electronic components, is also continuously improving its technical level to provide high-density wiring, thin shape, and micro-aperture. , High heat dissipation. The substrate material determines the performance of the printed circuit substrate to a large extent, so it is urgent to develop a new generation of substrate materials. [0003] Adhesive film or resin-coated copper foil without reinforcing material is developed and applied as a new generation of substrate materials because it can achieve thinner shape, high-density wiring, and fine pore size. Since there is no reinforcing material, inorganic fillers are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J157/02C09J171/12C09J161/06C09J179/04C09J11/04C09J7/30H05K1/03B32B17/02B32B17/12B32B15/20B32B15/14B32B7/12
CPCC09J163/00C09J157/02C09J171/12C09J11/04C09J7/30H05K1/036B32B5/02B32B5/26B32B15/20B32B15/14B32B7/12C08L2203/206C08K2201/003C09J2203/326B32B2250/40B32B2262/101B32B2457/08C08L61/06C08K3/36C08L79/04C08L71/123C08L57/02
Inventor 佘乃东刘潜发黄增彪许永静柴颂刚张艳华
Owner GUANGDONG SHENGYI SCI TECH
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