116 results about "Ethyl vinyl" patented technology

Provided is curable resin composition which gives a cured article excellent in chemical resistance, dielectric properties, low water-absorption, heat resistance, flame retardance, and mechanical properties and which is usable in applications such as dielectric materials, insulating materials, heat-resistant materials, and structural materials. The curable resin composition includes a component (A) which is a polyphenylene ether oligomer having a number-average molecular weight of 700 to 4,000 and having a vinyl group at both end and a component (B) which is a solvent-soluble polyfunctional vinylaromatic copolymer which has structural units derived from monomers including a divinylaromatic compound (a) and an ethylvinylaromatic compound (b) and in which the content of repeating units derived from the divinylaromatic compound (a) is 20 mol % or higher, the ratio of the amount (wt. %) of the component (A) to that (wt. %) of the component (B) being (20 to 98):(2 to 80). The composition can further contain a layered silicate, a halogenated flame retardant, etc.

Disclosed is an ultrapure 4-methylpyrazole containing less than 0.1% pyrazole and containing less than 10 ppm each of hydrazine and nitrobenzaldehyde. The ultrapure 4-methylpyrazole is prepared by a novel process so that less than 0.01% of ethylvinyl ether is present.

Nano-porous low dielectric constant films are deposited utilizing materials having reactive by-products readily removed from a processing chamber by plasma cleaning. In accordance with one embodiment, an oxidizable silicon containing compound is reacted with an oxidizable non-silicon component having thermally labile groups, in a reactive oxygen ambient and in the presence of a plasma. The deposited silicon oxide film is annealed to form dispersed microscopic voids or pores that remain in the nano-porous silicon. Oxidizable non-silicon components with thermally labile groups that leave by-products readily removed from the chamber, include but are not limited to, limonene, carene, cymene, fenchone, vinyl acetate, methyl methacrylate, ethyl vinyl ether, tetrahydrofuran, furan, 2,5 Norbornadiene, cyclopentene, cyclopentene oxide, methyl cyclopentene, 2-cyclopentene-1-one, and 1-butene.

A composite molded body, and its manufacturing method, is provided wherein the composite body contains a layer comprising a copolymer of tetrafluoroethylene (TFE) and perfluoro(ethyl vinyl ether) (PEVE). The composite body can be manufactured under conditions in which an adjoined layer of thermoplastic resin and / or thermosetting resin is not be melted, thermally degraded or decomposed. The copolymer has a PEVE content of 20 to 80 weight percent, based on the total weight of the copolymer, and a melt flow rate of from 0.1 to 100 g / 10 min, as measured in compliance with ASTM D1238 at a temperature of 250 DEG C + / - 0.1 using a 5 kg weight.

The present invention relates to a symmetrical multi-layer tube based on polyamide and ethyl vinyl alcohol (EVOH) or polyvinyl alcohol (PVOH) for transferring fluids. As examples of tubes for transferring fluids, mention may be made of fuel (gasoline, diesel fuel) pipes, in particular for carrying fuel from the tank to the engine of motor vehicles. Other examples of fluid transfer include, but are not limited to, the fluids used in fuel cells, CO2 systems for cooling, hydraulic systems, cooling circuits and air-conditioning circuits, and medium-pressure power transfer.

The present invention provides a thermosetting resin composition, a prepreg produced by using the thermosetting resin composition, and a metal foil clad laminate, wherein the thermosetting resin composition comprises a component (A) and a component (B), wherein the component (A) is a solvent-soluble polyfunctional vinyl aromatic copolymer, the solvent-soluble polyfunctional vinyl aromatic copolymer has the structure unit of a monomer comprising a divinyl aromatic compound (a) and an ethyl vinyl aromatic compound (b), the component (B) is an olefin resin having a number average molecular weightof 500-10000 and having a styrene structure weight ratio of 10-50%, and the molecule contains the butadiene structure added at the sites 1 and 2. According to the present invention, the prepreg produced by using the thermosetting resin composition and the metal foil clad laminate have good toughness, maintain high glass transition temperature, low water absorption, excellent dielectric property and damp heat resistance, can be used in the field of high-frequency high-speed printed circuit boards, and are further suitable for multi-layer printed circuit board processing.