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Thermosetting epoxy resin composition

A technology of resin composition and epoxy resin, which is applied in the field of epoxy resin laminates, can solve the problems of high hardness, poor drilling quality, inconvenient use, etc.

Active Publication Date: 2010-05-12
NANYA PLASTICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] When the epoxy resin laminate uses natural aluminum hydroxide as the filling material, because aluminum hydroxide contains crystal water, and the cracking temperature is only 250 ° C ~ 270 ° C, in the process of high temperature preparation or heat resistance test, aluminum hydroxide The crystalline water will crack into steam and escape, but the escaped steam and the generated steam pressure will easily cause the epoxy resin laminated board to delaminate and explode.
[0006] Silica has good thermal stability, but its hardness is too high, Mohs hardness is as high as 7-7.5
When the epoxy resin laminate uses natural silica as the filling material, because the hardness of silica is too high, it is not conducive to drilling, and the epoxy resin laminate will become hard and brittle after adding silica. sometimes inconvenient
For example, when drilling epoxy resin laminates, the wear of the drill bit is too large, and the quality of the drilling is not good; Cause electrical abnormality of finished printed circuit board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8

[0049] In embodiments 1 to 8, epoxy resin A, epoxy resin B, hardener A or hardener B and accelerators of the same proportion are used, but modified silicon dioxide of different proportions is added (Bao Lin company, product code G2C ), its formula composition is shown in Table 1, and utilizes acetone to be modulated into the thermosetting epoxy resin varnish that makes laminated board use, and wherein solid content accounts for 75%.

[0050] Prepare epoxy resin laminates by known methods, impregnate 7628 glass fiber cloth with the above-mentioned varnish resin solution, and then dry it at a temperature of 170°C (impregnation machine temperature) for several minutes, adjust and control the drying time to adjust the pre-drying The melt viscosity of the impregnated body is 4000-10000 poise. Finally, 4 pieces of film are stacked between two pieces of 35μm thick copper foil, at 25kg / cm 2 Under pressure, control the temperature and time of heating up, and after hot pressing, a lamin...

Embodiment 9～11

[0054] The formula composition is shown in Table 2. Embodiments 9-11 use the same proportion of epoxy resin A, epoxy resin B, hardener A and accelerator, and add 121PHR to 282.2PHR surface-treated modified silica filling material ( Baolin Company, product code name G2CARI), and utilize acetone to modulate into the thermosetting epoxy resin varnish that makes laminated board use, and wherein solid content accounts for 75%; Utilize again and embodiment 1~8 prepare laminated board identical method to prepare laminated board.

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Abstract

The invention discloses a thermosetting epoxy resin composition, which contains modified silicon dioxide and therefore can be used in the preparation of epoxy resin laminated boards with a low expansion coefficient property and excellent drilling processability. The modified silicon dioxide does not contain crystal water, has a low expansion coefficient property and comprises 40 to 80 weight percent of silicon dioxide and 60 to 20 percent of inorganic additive. And the modified silicon dioxide is prepared by sintering and melting at a high temperature above 1,000 DEG C and crushing.

Description

technical field [0001] The present invention relates to a thermosetting epoxy resin composition, in particular to a thermosetting epoxy resin composition containing modified silicon dioxide, which can be applied to the preparation of epoxy resin with low expansion coefficient and good drilling processability Resin laminate. Background technique [0002] Two important directives of the European Union: "Waste Electrical and Electronic Equipment Directive (WEEE)" and "Restriction of Hazardous Substances in Electrical and Electronic Equipment (RoHS)" have been officially implemented on July 1, 2006. The directives specify in detail the electrical and electronic products It is forbidden to use Pb, Cd, Hg, Cr 6+ , PBB, PBDE and other harmful substances, especially the prohibition of lead, will make global electronics enter the era of lead-free. [0003] The melting point of tin-lead alloy is 183°C, which is the alloy with the lowest melting point in industry. After changing to ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/04C08K9/02C08K3/36
Inventor 邹明仁
Owner NANYA PLASTICS CORP
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