Copper matrix composite material and preparation method thereof

Abstract

The invention provides a method for preparing a copper-based composite material. The preparation method includes the following steps: providing copper powder, zirconium tungstate powder and barium strontium titanate powder, and mixing the copper powder, zirconium tungstate powder and barium strontium titanate powder , to obtain the first mixed powder; utilize the method of dry ball milling to carry out ball milling to the first mixed powder, obtain the second mixed powder; carry out the first reduction heat treatment to the second mixed powder, obtain the third mixed powder; carry out the third mixed powder cold isostatic pressing to obtain the first block; hot pressing and sintering the first block to obtain the second block; and rolling the second block. The dry powder mixing process is used, thus improving the powder mixing efficiency and improving the powder mixing effect; the invention specially designs the reduction process, so that the oxidized powder in the powder mixing process can be accurately restored to the original state, and will not be reduced The oxide powder itself will not cause the oxygen content in the oxide to deviate from the ideal value, and the ordinary hot pressing sintering method is used, the technology is simple and mature, and the cost is low.

Description

technical field [0001] The invention relates to the field of low thermal expansion alloys, in particular to a copper-based composite material and a preparation method thereof. Background technique [0002] Copper is one of the most widely used materials in the current industrial field. It has long attracted the attention of the material field with its low thermal expansion coefficient, high electrical conductivity and excellent thermal conductivity. As the matrix of metal matrix composites, compared with aluminum, copper has better mechanical properties, higher melting point and better electrical and thermal conductivity. Although the density of copper is higher than that of aluminum, these properties are enough to make copper more than aluminum. It is more favored by industries such as electronic packaging. [0003] As we all know, the field of electronic packaging has the following general requirements for packaging materials: the thermal expansion coefficient should be r...

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Problems solved by technology

[0004] In response to such requirements, the current prior art has developed a copper-based composite material containing barium strontium titanate, which has the advantages of low thermal expansion coefficient, good processability, and strong thermal conductivity, but the applicant is still working on it During the research, it was found that such a copper-based composite material has at least the following defects: 1. In order to avoid the problem of oxidation during the powder mixing process, the method of wet ball milling was used, which resulted in prolonged ball milling time and poor powder mixing effect; 2. 1. Wet ball milling cannot solve the problem of powder oxidation very well. Slight oxidation of powder will also cause the thermal expansion coefficient and mechanical properties of the finished product to deviate from the ideal value; 3. Use spark plasma sintering process, which is not yet mature and the equipment The price is high, and the size of the finished product is strictly limited, which is not suitable for industrial production; 4. The rolling process has not been optimized and is too complicated; 5. The composition of the powder is too simple, which leads to an increase in the thermal expansion coefficient of the rolled plate. In order to restore the thermal expansion Coefficient, but also annealing heat treatment for the rolled plate, which ultimately makes the material processing process very complicated

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